Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
ICE3AR4780VJZ
MA001147652
PG-DIP-7-4
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
3.649
0.049
0.194
3.884
157.726
0.283
1.430
46.238
429.009
6.460
1.911
0.278
1.575
Average
Mass
[%]
0.56
0.01
0.03
0.60
24.17
0.04
0.22
7.08
65.73
0.99
0.29
0.04
0.24
29. August 2013
652.69 mg
Sum
[%]
0.56
Average
Mass
[ppm]
5591
74
298
5952
24.81
0.04
241656
433
2191
70842
73.03
0.99
0.29
657299
9897
2928
426
0.28
2413
2839
1000000
730332
9897
2928
247980
433
Sum
[ppm]
5591
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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