HVC Series
High Voltage Chip Resistors
®
Ohmcraft’s fine line, thick film patterning technology provides high level of stability
and voltage ratings in surface mount chip resistors.
♦
Voltage Ratings to 3500 Volts
♦
Resistance Values to 2,000
Gigohms
♦
Ultra High Stability
♦
Tight Tolerances ( to 0.1% )
♦
Low TCR ( to 25 ppm/ºC )
♦
Low VCR ( to 1 ppm/V )
♦
Very Low noise
The usual technologies used for manufacturing resistors
depend upon composite materials that have limitations.
Traditional thick-film process methods limit performance
characteristics and thin-film methods are limited in
attainable ohmic values.
Ohmcraft’s
fine line patterning
offers the best characteristics of both methods, plus adds
many unique features.
Ohmcraft’s
resistors feature a
longer, high-aspect ratio trace of lower resistivity film.
The combination of long line, high-aspect ratio, and
higher conductivity film, give
Ohmcraft
resistors
unmatched design efficiency, versatility, linearity, stability
and low noise. The
Ohmcraft’s
fine line patterning
methods allow control of process parameters to very tight
tolerances. The result is chip resistors with outstanding
stability and high voltage ratings.
Leaded resistors, dividers and networks are manufactured
using the same fine line patterning technologies. For
additional information on those products, please refer to the
appropriate data sheets.
Maximum Continuous Voltage:
Ohmcraft’s
high voltage chip resistors offer voltage
ratings that are much higher than conventional screen
printed resistors of the same size and resistive value.
3500
3000
e
g
2500
a
t
l
2000
o
V
1500
.
x
a
1000
M
500
0
Maximum Continuous Voltage Ratings
Ohmcraft
Conventional
Superior Pulse Handing Capabilities:
Ohmcraft’s
HVC resistors are able to withstand a
wide range of pulses. Contact
Ohmcraft
to discuss
your pulse handling requirements.
0402 0603 0805 1206 2010 2512 3512
Ratings
0402
Max. Power (W)
Max. Voltage
2
(V)
(In air)
Resistance Range
(ohms)
0.040
150
1K-
20G
0603
0.060
400
1K-
300G
0805
0.200
600
1K-
350G
Case Size
1
1206
0.330
1200
1K-
500G
2010
1.000
1700
10K-
1T
2512
2.000
2500
10K-
2.0T
3512
3.000
3500
10K-
2.0T
Note 1: Other standard & custom case sizes are available.
Note 2: The continuous maximum voltage applied cannot exceed the maximum power rating.
HVC1105
Dimensions
Wrap-around
Type B, T & U
terminations
Case Size
▼
0402
Length (L)
(mils)
40 + 5
63 (+10,-5)
79 (+10,-5)
126 +10
200 (+10,-5)
250 (+10,-5)
350(+10,-5)
Width (W)
(mils)
20 + 3
31 + 5
50 + 5
61 + 7
100 + 5
125 (+5,-10)
125 + 5
Thickness (T)
Max. (mils)
20
20
25
30
30
30
30
Pad (D)
(mils)
10 (+ 5)
10 (+10,-5)
10 (+10,-5)
15 (+10,-5)
20 (+10,-5)
20 (+10,-5)
20 (+10,-5)
L = Length
W = Width
T = Thickness
D = Pad dimension
Bondable
Type G, Z & S
terminations
0603
0805
1206
2010
2512
3512
How to build a part number….
Type
Case size
TCR
1
Value
2
Tolerance
3
Termination
HVC
High Voltage See dimension E = + 25ppm/ºC
Chip
table above
H = + 50ppm/ºC
K = + 100ppm/ºC
L = + 200ppm/ºC
Note 1: TCR measured from 25
º
C to 75
º
C.
Note 2: Value is dependent on case size.
Note 3: Tolerance is dependent on case size & value.
Resistance value
expressed as a four
digit number where
the first three num-
bers are the signifi-
cant value, and the
forth number is the
number of zeros.
B = + 0.1 %
C = + 0.25 %
D = + 0.5 %
F = + 1.0 %
G = + 2.0%
J = + 5.0 %
K = + 10 %
L = + 20 %
B =
Solderable wrap-around
(Sn63Pb37 solder over
nickel barrier)
S =
Solderable single surface
(flip-chip)
G =
Wire Bondable (gold)
T
= Solderable wrap-around
matte Tin
Z
= Solderable single surface
matte Tin
Example:
For a High Voltage, 125 Meg-ohm resistor with case size of 0805,
a TCR of + 50 ppm/C, a +1% tolerance, and wrap-around solderable
terminations - the part number would be:
HVC0805H1256FB
9 3 P a pe r M ill St reet
H o neo y e F a l l s, New Yo r k 1 4 4 7 2
P ho ne: ( 5 8 5 ) 6 2 4 - 2 6 1 0
F a x: ( 5 8 5 ) 6 2 4 - 2 6 9 2
E- ma i l: sa l es @o h mcra f t .co m
We b: w w w .o h mc ra f t .co m
HVC1105
®
stm32/stm8
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
