CYStech Electronics Corp.
N-Channel Enhancement Mode Power MOSFET
Spec. No. : C740I3
Issued Date : 2010.06.24
Revised Date : 2011.11.10
Page No. : 1/11
MTN5N50I3
Description
BV
DSS
: 500V
R
DS(ON) max.
: 1.6Ω
I
D
: 4.5A
The MTN5N50I3 is a N-channel enhancement-mode MOSFET, providing the designer with the best
combination of fast switching, ruggedized device design, low on-resistance and cost effectiveness.
The TO-251 package is universally preferred for all commercial-industrial applications
Features
•
Low On Resistance
•
Simple Drive Requirement
•
Low Gate Charge
•
Fast Switching Characteristic
•
RoHS compliant package
Applications
•
Open Framed Power Supply
•
Adapter
•
STB
Symbol
MTN5N50I3
Outline
TO-251AB
TO-251AA
G：Gate
D：Drain
S：Source
G
D S
G
D S
MTN5N50I3
CYStek Product Specification
CYStech Electronics Corp.
Absolute Maximum Ratings
(T
C
=25°C)
Parameter
Symbol
Spec. No. : C740I3
Issued Date : 2010.06.24
Revised Date : 2011.11.10
Page No. : 2/11
Limits
Unit
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Continuous Drain Current @T
C
=100°C
Pulsed Drain Current @ V
GS
=10V
(Note 1)
Single Pulse Avalanche Energy
(Note 2)
Avalanche Current
(Note 1)
Repetitive Avalanche Energy
(Note 1)
Peak Diode Recovery dv/dt
(Note 3)
Maximum Temperature for Soldering @ Lead at 0.125 in(0.318mm)
from case for 10 seconds
Total Power Dissipation (T
A
=25℃)
Total Power Dissipation (T
C
=25℃)
Linear Derating Factor
Operating Junction and Storage Temperature
Note : 1
.
Repetitive rating; pulse width limited by maximum junction temperature.
2
.
I
AS
=4.5A, V
DD
=50V, L=8mH, R
G
=25
Ω
, starting T
J
=+25
℃
.
3
.
I
SD
≤4.5A,
dI/dt≤100A/μs, V
DD
≤BV
DSS
, starting T
J
=+25
℃
.
V
DS
V
GS
I
D
I
D
I
DM
E
AS
I
AR
E
AR
dv/dt
T
L
P
D
Tj, Tstg
500
±30
4.5
2.7
18
90
4.5
4.8
4.5
300
1.14
48
0.38
-55~+150
V
V
A
A
A
mJ
A
mJ
V/ns
°C
W
W
W/°C
°C
Thermal Data
Parameter
Thermal Resistance, Junction-to-case, max
Thermal Resistance, Junction-to-ambient, max
Symbol
R
th,j-c
R
th,j-a
Value
2.6
110
Unit
°C/W
°C/W
MTN5N50I3
CYStek Product Specification
CYStech Electronics Corp.
Characteristics (T
C
=25°C, unless otherwise specified)
Symbol
Static
BV
DSS
∆BV
DSS
/∆Tj
V
GS(th)
*G
FS
I
GSS
I
DSS
500
-
2.0
-
-
-
-
-
-
0.4
-
2
-
-
-
-
20
3.8
10.6
18
21
33
20
738
74
8
-
-
-
280
2
-
-
4.0
-
±
100
1
10
1.6
-
-
-
-
-
-
-
-
-
-
1.5
4.5
18
-
-
V
V/°C
V
S
nA
μA
μA
Ω
Min.
Typ.
Max.
Unit
Test Conditions
Spec. No. : C740I3
Issued Date : 2010.06.24
Revised Date : 2011.11.10
Page No. : 3/11
*R
DS(ON)
Dynamic
*Qg
-
*Qgs
-
*Qgd
-
*t
d(ON)
-
*tr
-
*t
d(OFF)
-
*t
f
-
Ciss
-
Coss
-
Crss
-
Source-Drain Diode
*V
SD
-
*I
S
-
*I
SM
-
*trr
-
*Qrr
-
V
GS
=0, I
D
=250μA, Tj=25
℃
Reference to 25°C, I
D
=250μA
V
DS
= V
GS
, I
D
=250μA
V
DS
=15V, I
D
=2.25A
V
GS
=
±
30
V
DS
=500V, V
GS
=0
V
DS
=400V, V
GS
=0, T
C
=125°C
V
GS
=10V, I
D
=2.25A
nC
I
D
=4.5A, V
DD
=400V, V
GS
=10V
V
DD
=250V, I
D
=4.5A, V
GS
=10V,
R
G
=25
Ω
ns
pF
V
GS
=0V, V
DS
=25V, f=1MHz
V
A
ns
μC
I
S
=4.5A, V
GS
=0V
V
GS
=0, I
F
=4.5A, dI/dt=100A/μs
*Pulse Test : Pulse Width
≤300μs,
Duty Cycle≤2%
Ordering Information
Device
MTN5N50I3
Package
TO-251
(RoHS compliant)
Shipping
80 pcs / tube, 50 tubes / box
Marking
5N50
MTN5N50I3
CYStek Product Specification
CYStech Electronics Corp.
Typical Characteristics
Typical Output Characteristics
10
8
Drain Current - I
D
(A)
Static Drain-Source On-state
Resistance-R
DS(on)
(Ω)
15V
10V
9V
3.5
3
2.5
2
1.5
1
0.5
0
-100
Spec. No. : C740I3
Issued Date : 2010.06.24
Revised Date : 2011.11.10
Page No. : 4/11
Static Drain-Source On-resistance vs Ambient Temperature
7V
6
4
2
0
0
5
10
15
20
25
Drain-Source Voltage -V
DS
(V)
30
35
6V
5.5V
5V
VGS=4.5V
I
D
=2.25A,
V
GS
=10V
-50
0
50
100
Ambient Temperature-Ta(°C)
150
200
Static Drain-Source On-State resistance vs Drain Current
Drain Current vs Gate-Source Voltage
2.5
Static Drain-Source On-State
Resistance-R
DS(on)
(Ω)
V
GS
=10V
10
Ta=25°C
V
DS
=30V
2
Drain Current-I
D
(on)(A)
8
6
4
2
0
V
DS
=10V
1.5
1
0.1
1
Drain Current-I
D
(A)
Static Drain-Source On-State Resistance vs Gate-Source
Voltage
15
Ta=25°C
Static Drain-Source On-State
Resistance-R
DS(ON)
(Ω)
10
0
5
10
15
Gate-Source Voltage-V
GS
(V)
Forward Drain Current vs Source-Drain Voltage
20
100
V
GS
=0V
Forward Current-I
F
(A)
12
10
Ta=150°C
9
6
I
D
=2.25A
1
Ta=25°C
3
0
0
2
4
6
8
Gate-Source Voltage-V
GS
(V)
10
12
0.1
0
0.2
0.4
0.6
0.8
1
1.2
1.4
Source Drain Voltage -V
SD
(V)
MTN5N50I3
CYStek Product Specification
CYStech Electronics Corp.
Typical Characteristics(Cont.)
Capacitance vs Reverse Voltage
10000
Ciss
1000
Drain-Source Breakdown Voltage
BV
DSS
(V)
650
Spec. No. : C740I3
Issued Date : 2010.06.24
Revised Date : 2011.11.10
Page No. : 5/11
Brekdown Voltage vs Ambient Temperature
600
Capacitance-(pF)
100
Coss
550
10
f=1MHz
1
Crss
500
I
D
=250μA,
V
GS
=0V
450
-100
-50
0
50
100
150
200
0
5
10
15
20
25
Drain-to-Source Voltage-V
DS
(V)
30
Ambient Temperature-Tj(°C)
Maximum Safe Operating Area
100
10μs
Gate Charge Characteristics
12
V
DS
=100V
Gate-Source Voltage---V
GS
(V)
10
8
6
4
2
0
V
DS
=250V
V
DS
=400V
Drain Current --- I
D
(A)
10
100
μ
s
1ms
10ms
1
Operation in this area is
limited by RDS(ON)
0.1
100ms
DC
I
D
=4.5A
0.01
1
10
100
Drain-Source Voltage -V
DS
(V)
1000
0
4
8
12
16
20
Total Gate Charge---Qg(nC)
Maximum Drain Current vs Case Temperature
5
4.5
Maximum Drain Current---I
D
(A)
4
3.5
3
2.5
2
1.5
1
0.5
0
25
50
75
100
125
150
175
Case Temperature---T
C
(°C)
MTN5N50I3
CYStek Product Specification
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