Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SAF-XC888LM-6FFI 3V3 AC
MA000929924
PG-LQFP-64-14
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
Substances
silicon
magnesium
silicon
nickel
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7439-95-4
7440-21-3
7440-02-0
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
11.934
0.172
0.743
3.431
110.016
1.205
1.188
32.076
204.334
4.118
1.663
0.675
2.026
Average
Mass
[%]
3.19
0.05
0.20
0.92
29.45
0.32
0.32
8.59
54.69
1.10
0.45
0.18
0.54
29. August 2013
373.58 mg
Sum
[%]
3.19
Average
Mass
[ppm]
31946
459
1990
9184
30.62
0.32
294490
3224
3180
85860
63.60
1.10
0.45
546961
11022
4452
1808
0.72
5424
7232
1000000
636001
11022
4452
306123
3224
Sum
[ppm]
31946
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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