Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SAK-XC878CM-16FFA 5V AC
MA000879602
PG-LQFP-64-5
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
Substances
silicon
magnesium
silicon
nickel
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7439-95-4
7440-21-3
7440-02-0
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
10.632
0.172
0.743
3.431
110.016
2.078
1.194
32.228
205.307
4.118
1.663
0.626
1.879
Average
Mass
[%]
2.84
0.05
0.20
0.92
29.41
0.56
0.32
8.62
54.87
1.10
0.44
0.17
0.50
29. August 2013
374.09 mg
Sum
[%]
2.84
Average
Mass
[ppm]
28420
459
1987
9171
30.58
0.56
294092
5554
3191
86153
63.81
1.10
0.44
548824
11007
4446
1674
0.67
5022
6696
1000000
638168
11007
4446
305709
5554
Sum
[ppm]
28420
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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