Dual high-performance operational amplifier
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | SOP, SOP8,.25 |
| Reach Compliance Code | unknown |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK |
| 频率补偿 | YES |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e0 |
| 低-失调 | NO |
| 标称负供电电压 (Vsup) | -15 V |
| 功能数量 | 2 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | +-15 V |
| 认证状态 | Not Qualified |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |

| SA5512D | SE5512 | SA5512N | SA5512 | NE5512N | NE5512D | NE5512 | |
|---|---|---|---|---|---|---|---|
| 描述 | Dual high-performance operational amplifier | Dual high-performance operational amplifier | Dual high-performance operational amplifier | Dual high-performance operational amplifier | Dual high-performance operational amplifier | Dual high-performance operational amplifier | Dual high-performance operational amplifier |
| 是否Rohs认证 | 不符合 | - | 不符合 | - | 不符合 | 不符合 | - |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - |
| 包装说明 | SOP, SOP8,.25 | - | DIP, DIP8,.3 | - | DIP, DIP8,.3 | SOP, SOP8,.25 | - |
| Reach Compliance Code | unknown | - | unknown | - | unknown | unknow | - |
| 放大器类型 | OPERATIONAL AMPLIFIER | - | OPERATIONAL AMPLIFIER | - | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | - |
| 架构 | VOLTAGE-FEEDBACK | - | VOLTAGE-FEEDBACK | - | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | - |
| 频率补偿 | YES | - | YES | - | YES | YES | - |
| JESD-30 代码 | R-PDSO-G8 | - | R-PDIP-T8 | - | R-PDIP-T8 | R-PDSO-G8 | - |
| JESD-609代码 | e0 | - | e0 | - | e0 | e0 | - |
| 低-失调 | NO | - | NO | - | NO | NO | - |
| 标称负供电电压 (Vsup) | -15 V | - | -15 V | - | -15 V | -15 V | - |
| 功能数量 | 2 | - | 2 | - | 2 | 2 | - |
| 端子数量 | 8 | - | 8 | - | 8 | 8 | - |
| 最高工作温度 | 85 °C | - | 85 °C | - | 70 °C | 70 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | SOP | - | DIP | - | DIP | SOP | - |
| 封装等效代码 | SOP8,.25 | - | DIP8,.3 | - | DIP8,.3 | SOP8,.25 | - |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE | - | IN-LINE | - | IN-LINE | SMALL OUTLINE | - |
| 电源 | +-15 V | - | +-15 V | - | +-15 V | +-15 V | - |
| 认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | - |
| 标称供电电压 (Vsup) | 15 V | - | 15 V | - | 15 V | 15 V | - |
| 表面贴装 | YES | - | NO | - | NO | YES | - |
| 技术 | BIPOLAR | - | BIPOLAR | - | BIPOLAR | BIPOLAR | - |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | - | COMMERCIAL | COMMERCIAL | - |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | GULL WING | - | THROUGH-HOLE | - | THROUGH-HOLE | GULL WING | - |
| 端子节距 | 1.27 mm | - | 2.54 mm | - | 2.54 mm | 1.27 mm | - |
| 端子位置 | DUAL | - | DUAL | - | DUAL | DUAL | - |
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