Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSC084P03NS3E G
MA001408428
PG-TDSON-8-5
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
iron
phosphorus
copper
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
1.835
0.038
0.011
37.762
0.057
0.095
6.749
40.683
1.470
0.166
0.046
0.037
1.758
0.011
0.003
11.320
0.007
0.022
22.292
Average
Mass
[%]
1.48
0.03
0.01
30.36
0.05
0.08
5.43
32.71
1.18
0.13
0.04
0.03
1.41
0.01
0.00
9.10
0.01
0.02
17.92
21. September 2015
124.36 mg
Sum
[%]
1.48
Average
Mass
[ppm]
14754
304
91
30.40
0.05
303646
459
764
54268
38.22
1.18
0.13
327138
11819
1331
370
296
1.48
14133
91
27
9.11
91026
54
179
17.95
179250
179483
1000000
91144
14799
382170
11819
1331
304041
459
Sum
[ppm]
14754
wire
encapsulation
leadfinish
plating
solder
heatspreader
heat sink CLIP
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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