Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSZ180P03NS3 G
MA001407814
PG-TSDSON-8-1
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
phosphorus
zinc
iron
copper
phosphorus
zinc
iron
copper
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7723-14-0
7440-66-6
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
0.936
0.002
0.009
0.189
7.689
0.053
0.037
1.908
16.576
0.375
0.081
0.029
0.023
1.111
0.001
0.005
0.094
3.816
0.001
0.004
0.078
3.182
Average
Mass
[%]
2.59
0.01
0.03
0.52
21.24
0.15
0.10
5.27
45.79
1.04
0.22
0.08
0.06
3.07
0.00
0.01
0.26
10.54
0.00
0.01
0.22
8.79
16. September 2015
36.20 mg
Sum
[%]
2.59
Average
Mass
[ppm]
25851
65
262
5231
21.80
0.15
212406
1454
1023
52699
51.16
1.04
0.22
457920
10351
2232
803
643
3.21
30690
32
130
2596
10.81
105415
27
108
2165
9.02
87897
90197
1000000
108173
32136
511642
10351
2232
217964
1454
Sum
[ppm]
25851
wire
encapsulation
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
leadfinish
plating
solder
heatspreader
heat sink CLIP
inorganic material
non noble metal
non noble metal
non noble metal
< 10%
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com