Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
wire
encapsulation
SPA08N50C3
MA000358775
PG-TO220-3-31
Material Group
inorganic material
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
zinc
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
antimony
silver
tin
zinc
copper
CAS#
if applicable
7440-21-3
7440-66-6
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
7440-66-6
7440-50-8
Issued
Weight*
Weight
[mg]
4.883
0.925
615.788
0.994
2.259
212.309
914.734
6.173
0.671
0.276
0.691
1.796
0.746
496.335
Average
Mass
[%]
0.22
0.04
27.26
0.04
0.10
9.40
40.51
0.27
0.03
0.01
0.03
0.08
0.03
21.98
28. August 2013
2258.58 mg
Sum
[%]
0.22
Average
Mass
[ppm]
2162
410
27.30
0.04
272644
440
1000
94001
50.01
0.27
0.03
405004
2733
297
122
306
0.12
795
330
22.01
219756
220086
1000000
1223
500005
2733
297
273054
440
Sum
[ppm]
2162
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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