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SA702D

产品描述Divide by: 64/65/72 triple modulus low power ECL prescaler
产品类别逻辑    逻辑   
文件大小50KB,共7页
制造商Philips Semiconductors (NXP Semiconductors N.V.)
官网地址https://www.nxp.com/
下载文档 详细参数 选型对比 全文预览

SA702D概述

Divide by: 64/65/72 triple modulus low power ECL prescaler

SA702D规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Philips Semiconductors (NXP Semiconductors N.V.)
包装说明SOP, SOP8,.25
Reach Compliance Codeunknow
JESD-30 代码R-PDSO-G8
JESD-609代码e0
逻辑集成电路类型PRESCALER
最大频率@ Nom-Su1200000000 Hz
端子数量8
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装等效代码SOP8,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE
电源3/5 V
认证状态Not Qualified
表面贴装YES
技术ECL
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL

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Philips Semiconductors RF Communications Products
Product specification
Divide by: 64/65/72 triple modulus low power
ECL prescaler
SA702
DESCRIPTION
The SA702 triple modulus (Divide By
64/65/72) low power ECL prescaler is used in
synthesizer systems to achieve low phase
lock time, broad operating range, high
reference frequency and small frequency
step sizes. The minimum supply voltage is
2.7V and is compatible with the CMOS
UMA1005 synthesizer from Philips and other
logic circuits. The low supply current allows
application in battery operated low-power
equipment. Maximum input signal frequency
is 1.1GHz for cellular and other land mobile
applications. There is no lower frequency
limit due to a fully static design. The circuit is
implemented in ECL technology on the
QUBiC process. The circuit will be available
in an 8-pin SO package with 150 mil package
width and in 8-pin dual in-line plastic
package.
FEATURES
Low voltage operation
Low current consumption
Operation up to 1.1GHz
ESD hardened
APPLICATIONS
PIN CONFIGURATION
N, D Package
1
2
3
4
8
7
6
5
IN
GND
MC1
OUT
IN
V
C
C
MC2
OUT
Cellular phones
Cordless phones
RF LANs
Test and measurement
Military radio
VHF/UHF mobile radio
VHF/UHF hand-held radio
ORDERING INFORMATION
DESCRIPTION
8-Pin Plastic Dual In-Line Package (DIP)
8-Pin Plastic Small Outline (SO) package (Surface-mount)
TEMPERATURE RANGE
-40 to +85°C
-40 to +85°C
ORDER CODE
SA702N
SA702D
DWG #
0404B
0174C
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
CC
V
IN
I
O
T
STG
T
A
θ
JA
Supply voltage
Voltage applied to any other pin
Output current
Storage temperature range
Operating ambient temperature range
Thermal impedance
D package
N package
PARAMETER
RATING
-0.3 to +7.0
-0.3 to (V
CC
+ 0.3)
10
-65 to +125
-55 to +125
158
108
UNITS
V
V
mA
°C
°C
°C/W
June 17, 1993
2
853-1709 10044

SA702D相似产品对比

SA702D SA702N SA702
描述 Divide by: 64/65/72 triple modulus low power ECL prescaler Divide by: 64/65/72 triple modulus low power ECL prescaler Divide by: 64/65/72 triple modulus low power ECL prescaler
是否Rohs认证 不符合 不符合 -
厂商名称 Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) -
包装说明 SOP, SOP8,.25 DIP, DIP8,.3 -
Reach Compliance Code unknow unknow -
JESD-30 代码 R-PDSO-G8 R-PDIP-T8 -
JESD-609代码 e0 e0 -
逻辑集成电路类型 PRESCALER PRESCALER -
最大频率@ Nom-Su 1200000000 Hz 1200000000 Hz -
端子数量 8 8 -
最高工作温度 85 °C 85 °C -
最低工作温度 -40 °C -40 °C -
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY -
封装代码 SOP DIP -
封装等效代码 SOP8,.25 DIP8,.3 -
封装形状 RECTANGULAR RECTANGULAR -
封装形式 SMALL OUTLINE IN-LINE -
电源 3/5 V 3/5 V -
认证状态 Not Qualified Not Qualified -
表面贴装 YES NO -
技术 ECL ECL -
温度等级 INDUSTRIAL INDUSTRIAL -
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
端子形式 GULL WING THROUGH-HOLE -
端子节距 1.27 mm 2.54 mm -
端子位置 DUAL DUAL -

 
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