Ceramic Capacitor, Multilayer, Ceramic, 50V, 3.7% +Tol, 3.7% -Tol, C0G, 30ppm/Cel TC, 0.0000027uF, Surface Mount, 0402, CHIP, LEAD FREE
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| Objectid | 1079005410 |
| 包装说明 | , 0402 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 电容 | 0.0000027 µF |
| 电容器类型 | CERAMIC CAPACITOR |
| 介电材料 | CERAMIC |
| 高度 | 0.5 mm |
| JESD-609代码 | e3 |
| 长度 | 1 mm |
| 安装特点 | SURFACE MOUNT |
| 多层 | Yes |
| 负容差 | 3.7037% |
| 端子数量 | 2 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装形状 | RECTANGULAR PACKAGE |
| 封装形式 | SMT |
| 包装方法 | TR, PAPER, 13 INCH |
| 正容差 | 3.7037% |
| 额定（直流）电压（URdc） | 50 V |
| 尺寸代码 | 0402 |
| 表面贴装 | YES |
| 温度特性代码 | C0G |
| 温度系数 | 30ppm/Cel ppm/°C |
| 端子面层 | Matte Tin (Sn) - with Nickel (Ni) barrier |
| 端子形状 | WRAPAROUND |
| 宽度 | 0.5 mm |
| GUQ04CG2R7B50NTD | GUQ04CG0R2B100NT | GUQ04CG0R2B100NTD | GUQ04CG1R2B50NT | GUQ04CG2R2B50NT | GUQ04CG2R2B50NTD | GUQ04CG2R2C100NTD | GUQ21CG1R2B50NT | GUQ04CG2R7B50NT | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Ceramic Capacitor, Multilayer, Ceramic, 50V, 3.7% +Tol, 3.7% -Tol, C0G, 30ppm/Cel TC, 0.0000027uF, Surface Mount, 0402, CHIP, LEAD FREE | Ceramic Capacitor, Multilayer, Ceramic, 100V, 50% +Tol, 50% -Tol, C0G, 30ppm/Cel TC, 0.0000002uF, Surface Mount, 0402, CHIP, LEAD FREE | Ceramic Capacitor, Multilayer, Ceramic, 100V, 50% +Tol, 50% -Tol, C0G, 30ppm/Cel TC, 0.0000002uF, Surface Mount, 0402, CHIP, LEAD FREE | Ceramic Capacitor, Multilayer, Ceramic, 50V, 8.33% +Tol, 8.33% -Tol, C0G, 30ppm/Cel TC, 0.0000012uF, Surface Mount, 0402, CHIP, LEAD FREE | Ceramic Capacitor, Multilayer, Ceramic, 50V, 4.55% +Tol, 4.55% -Tol, C0G, 30ppm/Cel TC, 0.0000022uF, Surface Mount, 0402, CHIP, LEAD FREE | Ceramic Capacitor, Multilayer, Ceramic, 50V, 4.55% +Tol, 4.55% -Tol, C0G, 30ppm/Cel TC, 0.0000022uF, Surface Mount, 0402, CHIP, LEAD FREE | Ceramic Capacitor, Multilayer, Ceramic, 100V, 11.36% +Tol, 11.36% -Tol, C0G, 30ppm/Cel TC, 0.0000022uF, Surface Mount, 0402, CHIP, LEAD FREE | Ceramic Capacitor, Multilayer, Ceramic, 50V, 8.33% +Tol, 8.33% -Tol, C0G, 30ppm/Cel TC, 0.0000012uF, Surface Mount, 0805, CHIP, LEAD FREE | Ceramic Capacitor, Multilayer, Ceramic, 50V, 3.7% +Tol, 3.7% -Tol, C0G, 30ppm/Cel TC, 0.0000027uF, Surface Mount, 0402, CHIP, LEAD FREE |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| Objectid | 1079005410 | 1079005205 | 1079005204 | 1079005351 | 1079005399 | 1079005398 | 1079005400 | 1079006666 | 1079005411 |
| 包装说明 | , 0402 | , 0402 | , 0402 | , 0402 | , 0402 | , 0402 | , 0402 | , 0805 | , 0402 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 电容 | 0.0000027 µF | 2e-7 µF | 2e-7 µF | 0.0000012 µF | 0.0000022 µF | 0.0000022 µF | 0.0000022 µF | 0.0000012 µF | 0.0000027 µF |
| 电容器类型 | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR |
| 介电材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 高度 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.85 mm | 0.5 mm |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 2 mm | 1 mm |
| 安装特点 | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT |
| 多层 | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| 负容差 | 3.7037% | 50% | 50% | 8.3333% | 4.5455% | 4.5455% | 11.3636% | 8.3333% | 3.7037% |
| 端子数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装形状 | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE |
| 封装形式 | SMT | SMT | SMT | SMT | SMT | SMT | SMT | SMT | SMT |
| 包装方法 | TR, PAPER, 13 INCH | TR, PAPER, 7 INCH | TR, PAPER, 13 INCH | TR, PAPER, 7 INCH | TR, PAPER, 7 INCH | TR, PAPER, 13 INCH | TR, PAPER, 13 INCH | TR, PAPER, 7 INCH | TR, PAPER, 7 INCH |
| 正容差 | 3.7037% | 50% | 50% | 8.3333% | 4.5455% | 4.5455% | 11.3636% | 8.3333% | 3.7037% |
| 额定（直流）电压（URdc） | 50 V | 100 V | 100 V | 50 V | 50 V | 50 V | 100 V | 50 V | 50 V |
| 尺寸代码 | 0402 | 0402 | 0402 | 0402 | 0402 | 0402 | 0402 | 0805 | 0402 |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 温度特性代码 | C0G | C0G | C0G | C0G | C0G | C0G | C0G | C0G | C0G |
| 温度系数 | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C |
| 端子面层 | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrier |
| 端子形状 | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND |
| 宽度 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 1.25 mm | 0.5 mm |
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