Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SAF-XE167FM-72F80L AA
MA001021916
PG-LQFP-144-13
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
38.601
0.122
0.489
9.785
397.309
3.925
4.933
133.186
848.443
9.120
3.110
2.539
7.616
Average
Mass
[%]
2.65
0.01
0.03
0.67
27.23
0.27
0.34
9.13
58.15
0.62
0.21
0.17
0.52
29. August 2013
1459.18 mg
Sum
[%]
2.65
Average
Mass
[ppm]
26454
84
335
6706
27.94
0.27
272282
2690
3381
91274
67.62
0.62
0.21
581453
6250
2132
1740
0.69
5219
6959
1000000
676108
6250
2132
279407
2690
Sum
[ppm]
26454
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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