Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTM7710G
MA000913098
PG-DSO-28-22
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
10.397
0.072
0.288
5.754
233.637
1.733
1.099
78.611
470.019
4.913
0.196
0.000
0.678
0.524
2.469
Average
Mass
[%]
1.28
0.01
0.04
0.71
28.83
0.21
0.14
9.70
58.01
0.61
0.02
0.00
0.08
0.06
0.30
29. August 2013
810.39 mg
Sum
[%]
1.28
Average
Mass
[ppm]
12830
89
355
7100
29.59
0.21
288302
2138
1357
97004
67.85
0.61
579990
6063
242
1
0.10
836
646
0.36
3047
3693
1000000
1079
678351
6063
295846
2138
Sum
[ppm]
12830
wire
encapsulation
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
DSP 与 ARM 处理器
京公网安备 11010802033920号
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