Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
ICE2B765P2
MA000044974
PG-TO220-6-47
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
inorganic material
plastics
plastics
inorganic material
non noble metal
non noble metal
plastics
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
antimonytrioxide
brominated resin
epoxy resin
silicondioxide
tin
nickel
Polyimide
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
1309-64-4
-
-
60676-86-0
7440-31-5
7440-02-0
26023-21-2
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
9.727
1.367
0.410
1365.438
0.383
6.036
12.622
14.268
104.266
411.576
20.128
0.204
0.597
0.107
0.086
4.085
Average
Mass
[%]
0.50
0.07
0.02
69.98
0.02
0.31
0.65
0.73
5.34
21.09
1.03
0.01
0.03
0.01
0.00
0.21
29. August 2013
1951.30 mg
Sum
[%]
0.50
Average
Mass
[ppm]
4985
701
210
70.07
0.02
699758
196
3094
6468
7312
53434
28.12
1.03
0.01
0.03
210924
10315
105
306
55
44
0.22
2093
2192
1000000
281232
10315
105
306
700669
196
Sum
[ppm]
4985
wire
encapsulation
leadfinish
plating
glue
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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