Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE5205-2G
MA000600986
PG-TO263-7-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
11.039
0.810
0.243
808.613
2.557
8.786
96.641
480.277
13.037
0.212
0.001
0.232
0.186
8.879
0.032
0.106
106.210
Average
Mass
[%]
0.72
0.05
0.02
52.57
0.17
0.57
6.28
31.23
0.85
0.01
0.00
0.02
0.01
0.58
0.00
0.01
6.91
29. August 2013
1537.86 mg
Sum
[%]
0.72
Average
Mass
[ppm]
7178
526
158
52.64
0.17
525804
1663
5713
62841
38.08
0.85
312303
8477
138
0.01
0
151
121
0.61
5773
21
69
6.92
69064
69154
1000000
6045
138
380857
8477
526488
1663
Sum
[ppm]
7178
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com