8-Bit Microcontroller with accelerated two-clock 80C51 core 8kB 3V byte-erasable flash with 512-byte data EEPROM
P89LPC932A1 | P89LPC932A1FA | P89LPC932A1FHN | P89LPC932A1FDH | |
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描述 | 8-Bit Microcontroller with accelerated two-clock 80C51 core 8kB 3V byte-erasable flash with 512-byte data EEPROM | 8-Bit Microcontroller with accelerated two-clock 80C51 core 8kB 3V byte-erasable flash with 512-byte data EEPROM | 8-Bit Microcontroller with accelerated two-clock 80C51 core 8kB 3V byte-erasable flash with 512-byte data EEPROM | 8-Bit Microcontroller with accelerated two-clock 80C51 core 8kB 3V byte-erasable flash with 512-byte data EEPROM |
是否Rohs认证 | - | 符合 | 符合 | 符合 |
厂商名称 | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | - | QCCJ, LDCC28,.5SQ | QCCN, LCC28,.24SQ,25 | TSSOP, TSSOP28,.25 |
Reach Compliance Code | - | unknow | unknow | unknow |
位大小 | - | 8 | 8 | 8 |
CPU系列 | - | 8051 | 8051 | 8051 |
JESD-30 代码 | - | S-PQCC-J28 | S-PQCC-N28 | R-PDSO-G28 |
端子数量 | - | 28 | 28 | 28 |
最高工作温度 | - | 85 °C | 85 °C | 85 °C |
最低工作温度 | - | -40 °C | -40 °C | -40 °C |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | QCCJ | QCCN | TSSOP |
封装等效代码 | - | LDCC28,.5SQ | LCC28,.24SQ,25 | TSSOP28,.25 |
封装形状 | - | SQUARE | SQUARE | RECTANGULAR |
封装形式 | - | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
电源 | - | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | - | 768 | 768 | 768 |
ROM(单词) | - | 8192 | 8192 | 8192 |
ROM可编程性 | - | FLASH | FLASH | FLASH |
速度 | - | 12 MHz | 12 MHz | 12 MHz |
最大压摆率 | - | 18 mA | 18 mA | 18 mA |
表面贴装 | - | YES | YES | YES |
技术 | - | CMOS | CMOS | CMOS |
温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | - | J BEND | NO LEAD | GULL WING |
端子节距 | - | 1.27 mm | 0.635 mm | 0.635 mm |
端子位置 | - | QUAD | QUAD | DUAL |
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