Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTS3134D
MA001111558
PG-TO252-3-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
3.370
0.140
0.042
139.706
1.379
1.457
25.493
118.726
3.740
0.091
0.000
0.075
0.060
2.879
0.095
0.028
94.488
Average
Mass
[%]
0.86
0.04
0.01
35.66
0.35
0.37
6.51
30.31
0.95
0.02
0.00
0.02
0.02
0.73
0.02
0.01
24.12
29. August 2013
391.77 mg
Sum
[%]
0.86
Average
Mass
[ppm]
8601
357
107
35.71
0.35
356602
3519
3718
65072
37.19
0.95
303051
9547
232
0.02
1
192
154
0.77
7349
242
72
24.15
241184
241498
1000000
7695
233
371841
9547
357066
3519
Sum
[ppm]
8601
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com