Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPD60R950C6
MA001145358
PG-TO252-3-313
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
phosphorus
nickel
silver
tin
lead
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7723-14-0
7440-02-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
2.144
0.147
0.044
147.096
0.516
1.415
24.766
115.341
3.740
0.003
1.421
0.056
0.045
2.144
0.019
0.006
19.177
Average
Mass
[%]
0.67
0.05
0.01
46.25
0.16
0.44
7.79
36.26
1.18
0.00
0.45
0.02
0.01
0.67
0.01
0.00
6.03
29. August 2013
318.08 mg
Sum
[%]
0.67
Average
Mass
[ppm]
6739
463
139
46.31
0.16
462448
1622
4449
77862
44.49
1.18
362615
11758
11
0.45
4466
176
141
0.70
6742
60
18
6.04
60291
60369
1000000
7059
4477
444926
11758
463050
1622
Sum
[ppm]
6739
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com