Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTS56033-LBA
MA001141734
PG-TSON-24-3
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
5.920
0.021
0.084
1.685
68.425
1.663
0.192
9.862
85.697
2.547
0.378
0.116
0.093
4.435
Average
Mass
[%]
3.27
0.01
0.05
0.93
37.78
0.92
0.11
5.45
47.30
1.41
0.21
0.06
0.05
2.45
29. August 2013
181.12 mg
Sum
[%]
3.27
Average
Mass
[ppm]
32688
116
465
9304
38.77
0.92
377793
9183
1057
54453
52.86
1.41
0.21
473152
14060
2087
641
513
2.56
24488
25642
1000000
528662
14060
2087
387678
9183
Sum
[ppm]
32688
wire
encapsulation
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
< 10%
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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