Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
2EDL23I06PJ
MA001140334
PG-DSO-14-49
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
acrylic resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
1.871
0.014
0.057
1.150
46.675
0.258
0.173
9.368
77.202
1.226
0.307
0.172
0.610
Average
Mass
[%]
1.34
0.01
0.04
0.83
33.56
0.19
0.12
6.74
55.51
0.88
0.22
0.12
0.44
29. August 2013
139.08 mg
Sum
[%]
1.34
Average
Mass
[ppm]
13450
103
413
8265
34.44
0.19
335588
1856
1247
67358
62.37
0.88
0.22
555078
8816
2204
1237
0.56
4385
5622
1000000
623683
8816
2204
344369
1856
Sum
[ppm]
13450
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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