Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTS5030-2EKA
MA001130774
PG-DSO-14-40
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
3.425
0.017
0.070
1.392
56.512
0.955
0.168
7.711
75.941
1.226
1.417
0.177
0.837
Average
Mass
[%]
2.29
0.01
0.05
0.93
37.71
0.64
0.11
5.15
50.66
0.82
0.95
0.12
0.56
29. August 2013
149.85 mg
Sum
[%]
2.29
Average
Mass
[ppm]
22853
116
464
9288
38.70
0.64
377127
6373
1119
51462
55.92
0.82
0.95
506788
8183
9460
1184
0.68
5583
6767
1000000
559369
8183
9460
386995
6373
Sum
[ppm]
22853
wire
encapsulation
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com