Low-Voltage Dual 1-of-4 FET Multiplexer/Demultiplexer 16-TSSOP -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP-16 |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| Samacsys Description | Low-Voltage Dual 1-of-4 FET Multiplexer/Demultiplexer |
| 系列 | CBTLV/3B |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e4 |
| 长度 | 5 mm |
| 逻辑集成电路类型 | MULTIPLEXER AND DEMUX/DECODER |
| 湿度敏感等级 | 1 |
| 功能数量 | 2 |
| 输入次数 | 1 |
| 输出次数 | 4 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TUBE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2.5/3.3 V |
| 最大电源电流（ICC） | 0.01 mA |
| Prop。Delay @ Nom-Sup | 0.15 ns |
| 传播延迟（tpd） | 0.25 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.3 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 4.4 mm |
| Base Number Matches | 1 |
| SN74CBTLV3253PW | 74CBTLV3253DBQRG4 | SN74CBTLV3253RGYR | SN74CBTLV3253PWG4 | SN74CBTLV3253DRE4 | SN74CBTLV3253DE4 | SN74CBTLV3253D | 74CBTLV3253PWRE4 | 74CBTLV3253DGVRE4 | SN74CBTLV3253DBQR | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Low-Voltage Dual 1-of-4 FET Multiplexer/Demultiplexer 16-TSSOP -40 to 85 | Low-Voltage Dual 1-of-4 FET Multiplexer/Demultiplexer 16-SSOP -40 to 85 | Low-Voltage Dual 1-of-4 FET Multiplexer/Demultiplexer 16-VQFN -40 to 85 | Low-Voltage Dual 1-of-4 FET Multiplexer/Demultiplexer 16-TSSOP -40 to 85 | Low-Voltage Dual 1-of-4 FET Multiplexer/Demultiplexer 16-SOIC -40 to 85 | Low-Voltage Dual 1-of-4 FET Multiplexer/Demultiplexer 16-SOIC -40 to 85 | Low-Voltage Dual 1-of-4 FET Multiplexer/Demultiplexer 16-SOIC -40 to 85 | Low-Voltage Dual 1-of-4 FET Multiplexer/Demultiplexer 16-TSSOP -40 to 85 | Low-Voltage Dual 1-of-4 FET Multiplexer/Demultiplexer 16-TVSOP -40 to 85 | Low-Voltage Dual 1-of-4 FET Multiplexer/Demultiplexer 16-SSOP -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | TSSOP | SOIC | QFN | TSSOP | SOIC | SOIC | SOIC | TSSOP | SOIC | SOIC |
| 包装说明 | TSSOP-16 | SSOP, SSOP16,.25 | HVQCCN, LCC16/20,.14X.16,20 | TSSOP, TSSOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 | SOIC-16 | TSSOP, TSSOP16,.25 | TSSOP, TSSOP16,.25,16 | SSOP, SSOP16,.25 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compliant | compliant | compliant | compli | compli | compliant | compliant | compliant | compliant | compliant |
| 系列 | CBTLV/3B | CBTLV/3B | CBTLV/3B | CBTLV/3B | CBTLV/3B | CBTLV/3B | CBTLV/3B | CBTLV/3B | CBTLV/3B | CBTLV/3B |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PQCC-N16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 5 mm | 4.9 mm | 4 mm | 5 mm | 9.9 mm | 9.9 mm | 9.9 mm | 5 mm | 4.4 mm | 4.9 mm |
| 逻辑集成电路类型 | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER |
| 湿度敏感等级 | 1 | 2 | 2 | 1 | 1 | 1 | 1 | 1 | 1 | 2 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 输入次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 输出次数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | SSOP | HVQCCN | TSSOP | SOP | SOP | SOP | TSSOP | TSSOP | SSOP |
| 封装等效代码 | TSSOP16,.25 | SSOP16,.25 | LCC16/20,.14X.16,20 | TSSOP16,.25 | SOP16,.25 | SOP16,.25 | SOP16,.25 | TSSOP16,.25 | TSSOP16,.25,16 | SSOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
| 传播延迟（tpd） | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.75 mm | 1 mm | 1.2 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.2 mm | 1.2 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.635 mm | 0.5 mm | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.4 mm | 0.64 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 4.4 mm | 3.9 mm | 3.5 mm | 4.4 mm | 3.91 mm | 3.91 mm | 3.91 mm | 4.4 mm | 3.6 mm | 3.9 mm |
| 是否无铅 | 不含铅 | - | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | - | - | 不含铅 |
| Factory Lead Time | 1 week | 1 week | 6 weeks | - | 6 weeks | 6 weeks | 1 week | - | 1 week | 1 week |
| 包装方法 | TUBE | - | TR | - | TR | TUBE | TUBE | - | - | TR |
| 最大电源电流（ICC） | 0.01 mA | - | 0.01 mA | - | 0.01 mA | 0.01 mA | 0.01 mA | - | - | 0.01 mA |
| Base Number Matches | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
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