2 Pad Ceramic Package Quartz Crystal, 3.5 mm x 6 mm
Product Features:
Low Cost SMD Package
Low Profile Package
Compatible with Leadfree Processing
ILCX09 Series
Applications:
Fibre Channel
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
3.5 +/-0.15
6.0 +/- 0.15
Frequency
8 MHz to 100 MHz
ESR (Equivalent Series Resistance)
8 MHz – 48.0 MHz
rd
36 MHz – 100 MHz (3 O.T.)
60
Max.
60
Max.
1.1 Max.
2.9 +/- 0.2
2.0 typ.
Shunt Capacitance (C0)
Frequency Tolerance @ 25
C
Frequency Stability over
Temperature
Crystal Cut
Load Capacitance
Drive Level
Aging
Temperature
Operating
Storage
7 pF Max.
30
ppm Standard (see Part Number Guide for more options)
50
ppm Standard (see Part Number Guide for more options)
AT Cut
18 pF Standard (see Part Number Guide for more options)
500 uW Max.
5
ppm Max. / Year Standard
Recommended Pad Layout
2.2
Connection Diagram
2.4
0 C to +70 C Standard (see Part Number Guide for more
options)
-40 C to +85 C Standard
5.2
Dimension Units: mm
Part Number Guide
Package
Tolerance
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
ILCX09 -
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm*
Sample Part Number:
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm**
ILCX09 - FB1F18 - 20.000
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
Mode
(overtone)
F = Fundamental
3 = 3
rd
overtone
Load Capacitance
(pF)
Frequency
18 pF Standard
Or Specify
- 20.000 MHz
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
09/23/13_B
Specifications subject to change without notice
Page 1
2 Pad Ceramic Package Quartz Crystal, 3.5 mm x 6 mm
Pb Free Solder Reflow Profile:
Typical Circuit:
ILCX09 Series
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
16 +/-.3
8 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI, Date Code (yww)
Line 2: Frequency
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
09/23/13_B
Specifications subject to change without notice
Page 2
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
