Single Compression Contact:
Board-to-Board (BTB)
Series 70-9155
Designers for ruggedized connectors to meet harsh environments continue to look
for new products which will reduce size and cost without jeopardizing performance.
The new Ultra-Low Profile (ULP) compression contact from AVX surface mounts to
a PCB and provides a reliable compression connection to the mating board, even
under extreme shock and vibration applications. With over 20 years of 1-Piece
compression contact experience, this innovative contact offers full connector
performance functionality at the individual contact level. Thus, allowing single
contacts to be placed in any location or position on a PCB.
The high force beryllium copper contact is gold plated to maximize reliability and
signal integrity. The current offering has two contacts with nominal heights of
1.0mm and 1.5mm. Add in the “Z” axis tolerance range and the compressed height
covers 0.75mm up to 1.75mm. The contacts are supplied in tape and reel for easy
SMT placement.
APPLICATIONS
• Industrial/Ruggedized handheld or portable
devices
• BTB connection for any traditional power or
signal application
• Ground connections between PCB’s or
housings
FEATURES AND BENEFITS
• Reliable gold plated Beryllium Copper contacts for high cycle life
and signal integrity up to 1000 cycles
• Tape and reel packaged for automated SMT placement
• Sweeping beam design for pluggable/module applications
• Three gold plating options to match end product environmental or
expected life requirements
ELECTRICAL
• Current Rating: 3 Amps
• Voltage Rating: Based on place-
ment distance
ENVIRONMENTAL
• Operating Temperature:
-40ºC to +125ºC
MECHANICAL
• Contact Material: Beryllium Copper
• Contact Plating: Gold over Nickel
• Durability: 50, 500 and 1000 cycles
HOW TO ORDER
70
Prefix
9155
Series
001
Number
of Ways
Code
610
615
6XX
Contact Description
Nominal
Operating Height
1.00mm
1.50mm
Contact Operating
Height Range
0.75mm to 1.25mm
1.25mm to 1.75mm
Code
004
006
008
Gold
Thickness
0.1µm
0.4µm
0.8µm
00X
Contact Description
Description
Nickel under Plate, Gold on Nose
Tin on Remainder
Nickel under Plate, Gold on Nose
Tin on Remainder
Nickel under Plate, Gold on Nose
Tin on Remainder
Availability
Standard
Special
Order
Special
Order
1
Single Compression Contact:
Board-to-Board (BTB)
Series 70-9155
70-9155-001-610-006
NOMINAL WORKING HEIGHT 1.00MM
FULLY DEFLECTED
CONTACT
SUGGESTED MATING
PCB LAYOUT
NOTES:
1. 9155 LOW PROFILE CONTACT, WORKING HEIGHT 0.75MM 5TO 1.25MM.
2. FOR FULL DETAILS REFER TO PRODUCT SPECIFICATION 201-01-153 AND
APPLICATIONS NOTES 201-01-154.
3. MATERIAL: COPPER ALLOY 0.2MM THICK.
4. PLATING: NICKEL ALL OVER WITH GOLD ON CONTACT NOSE AND TIN ON THE
REMAINDER. PARTS TO BE PACKED IN TAPE AND REEL. QTY PER REEL 3000.
5. OUTLINE OF CONNECTOR, ORIENTATION END “A”.
6. AREA TO KEPT FREE OF SOLDER RESIST, FURTHER INFORMATION IN
APPLICATION NOTES.
7. AREA BETWEEN PADS TO BE KEPT CLEAR OF TRACKS AND COMPONENTS.
8. SMT PADS PLATED TIN.
9. MATING PAD PLATED GOLD OVER NICKEL.
SUGGESTED SMT
PCB LAYOUT
PACKING DETAILS
2
Single Compression Contact:
Board-to-Board (BTB)
Series 70-9155
70-9155-001-610-006
NOMINAL WORKING HEIGHT 1.50MM
FULLY DEFLECTED
CONTACT
SUGGESTED MATING
PCB LAYOUT
NOTES:
1. 9155 LOW PROFILE CONTACT, WORKING HEIGHT 0.75MM 5TO 1.25MM.
2. FOR FULL DETAILS REFER TO PRODUCT SPECIFICATION 201-01-153 AND
APPLICATIONS NOTES 201-01-154.
3. MATERIAL: COPPER ALLOY 0.2MM THICK.
4. PLATING: NICKEL ALL OVER WITH GOLD ON CONTACT NOSE AND TIN ON THE
REMAINDER. PARTS TO BE PACKED IN TAPE AND REEL. QTY PER REEL 3000.
5. OUTLINE OF CONNECTOR, ORIENTATION END “A”.
6. AREA TO KEPT FREE OF SOLDER RESIST, FURTHER INFORMATION IN
APPLICATION NOTES.
7. AREA BETWEEN PADS TO BE KEPT CLEAR OF TRACKS AND COMPONENTS.
8. SMT PADS PLATED TIN.
9. MATING PAD PLATED GOLD OVER NICKEL.
SUGGESTED SMT
PCB LAYOUT
PACKING DETAILS
3
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