BCcomponents
DATA SHEET
175 TMP
Aluminum electrolytic capacitors
High Temperature solid electrolytic
SMD
Product specification
File under BCcomponents, BC01
2001 Jul 05
BCcomponents
Product specification
Aluminum electrolytic capacitors
High Temperature solid electrolytic SMD
FEATURES
175 TMP
•
Polarized aluminum electrolytic capacitors SMD, solid
electrolyte MnO
2
•
Extremely long useful life, 20000 hours/125
°
C
•
Extended usable temperature range up to 175
°
C
•
Excellent impedance and ESR behaviour, at low and high
temperature
•
Charge and discharge proof, application with 0
Ω
resistance allowed
•
Reverse DC voltage up to 0.5
×
U
R
allowed
•
AC voltage up to 0.8
×
U
R
allowed
•
High shock and vibration capability
•
High ripple current per volume in SMD.
APPLICATIONS
122 SAL-RP
128 SAL-RPM
125
°C
SMD
JW102
CCA716
Fig.1 Component outline.
•
SMD technology
•
Smoothing, filtering, buffering
•
Telecommunications, general industrial, EDP, high end
power conversion
•
Power supplies, SMPS for telecommunications.
175 TMP
< ESR
176 TMP
200 TMP
automotive
QUICK REFERENCE DATA
DESCRIPTION
Nominal case sizes (L
×
W
×
H in mm)
Rated capacitance range, C
R
Tolerance on C
R
Rated voltage range, U
R
Category temperature range:
U
R
= 4 to 40 V
U
C
= 4 to 25 V
U
C
= 4 to 16 V
Endurance test at 175
°
C
Endurance test at 125
°
C
Useful life at 125
°
C
Useful life at 175
°
C
Useful life at 40
°
C, I
R
applied
Shelf life at 0 V, 125
°
C
Based on sectional specification
Climatic category IEC 60068
VALUE
8
×
8
×
10 (0810 housing), 8
×
8
×
8 (0808 housing)
1 to 68
µ
F
±
20%
4 to 40 V
−
55 to +85
°
C
−
55 to +125
°
C
−
55 to +175
°
C
1000 hours
10000 hours
20000 hours
2000 hours
>
300000 hours
500 hours
IEC 60384-4/EN130300
55/175/56
2001 Jul 05
2
BCcomponents
Product specification
Aluminum electrolytic capacitors
High Temperature solid electrolytic SMD
Selection chart for C
R
, U
R
and relevant nominal case sizes (L
×
W
×
H in mm)
U
R
(V) at T
amb
= 125
°
C
C
R
(
µ
F)
4
6.3
10
16
U
R
(V) at T
amb
= 175
°
C
4
1
1.5
2.2
4.7
6.8
10
15
22
33
47
68
Notes
1. Available on request.
2. T
amb
= 125
°
C, available on request.
6.3
10
16
16
16
20
25
175 TMP
T
amb
= 85
°
40
16
8.0
×
8.0
×
10(8)
8.0
×
8.0
×
10(8)
8.0
×
8.0
×
10(8)
−
−
−
−
−
−
−
−
−
8.0
×
8.0
×
10(8)
8.0
×
8.0
×
10(8)
−
−
−
−
−
−
−
−
8.0
×
8.0
×
10(8)
8.0
×
8.0
×
10(8)
note 2
−
−
−
−
−
−
8.0
×
8.0
×
10(8)
8.0
×
8.0
×
10(8)
note 2
note 2
−
−
−
−
8.0
×
8.0
×
10(8)
8.0
×
8.0
×
10(8)
note 2
note 2
−
−
−
8.0
×
8.0
×
10(8)
8.0
×
8.0
×
10(8)
note 1
note 2
−
−
note 1
8.0
×
8.0
×
10(8)
8.0
×
8.0
×
10(8)
8.0
×
8.0
×
10(8)
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
2001 Jul 05
3
BCcomponents
Product specification
Aluminum electrolytic capacitors
High Temperature solid electrolytic SMD
PACKAGING
175 TMP
Supplied in blister tape on reel. For general packaging information refer to data handbook BC01, section
“Packaging”.
Table 1
Tape and reel dimensions
PITCH
P
1
(mm)
16
TAPE WIDTH
W
(mm)
24
TAPE THICKNESS
T
2
(mm)
11
REEL DIA.
(mm)
380
PACKAGING
QUANTITY
PER REEL
500
CASE CODE
0808
0810
MECHANICAL DATA
0.4
±0.2
L
W B
C
S
C
D
H
CCA717
0.3
max.
Dimensions in mm.
Fig.2 Dimensional outline.
Table 2
Physical dimensions, mass and packaging quantities; see Fig.2
CASE
CODE
0808
0810
L
max
(mm)
8.4
8.4
W
max
(mm)
8.4
8.4
H
max
(mm)
8.7
10.5
NOMINAL
CASE SIZE
L
×
W
×
H
(mm)
8.0
×
8.0
×
8.0
8.0
×
8.0
×
10
∅
D
(mm)
8.0
8.0
B
max
(mm)
1
1
S
(mm)
4.7
4.7
C
(mm)
2.2
±
0.2
2.2
±
0.2
MASS
(g)
≈
0.75
≈
0.8
2001 Jul 05
4
BCcomponents
Product specification
Aluminum electrolytic capacitors
High Temperature solid electrolytic SMD
MOUNTING
The capacitors are designed for
automatic placement on to
printed-circuit boards.
Optimum dimensions of soldering
pads depend amongst others on
soldering method, mounting accuracy,
print lay-out and/or adjacent
components.
For recommended soldering pad
dimensions, refer to Fig.3 and Table 3.
Soldering
Soldering conditions are defined by
the curve, temperature versus time,
where the temperature is that
measured on the soldering pad during
processing.
Resistant against 260
°
C reflow
temperature see Fig.4.
Any temperature versus time curve
which does not exceed the specified
maximum curves may be applied.
AS A GENERAL PRINCIPLE,
TEMPERATURE AND DURATION
SHALL BE THE
MINIMUM
NECESSARY REQUIRED TO ENSURE
GOOD SOLDERING
CONNECTIONS.
Table 3
Recommended soldering pad dimensions
a
(mm)
3.0
b
(mm)
2.5
175 TMP
b
CCA857
a
Dimensions in mm.
c
a
Fig.3 Recommended soldering pad dimensions.
CASE CODE
0808
0810
c
(mm)
4.0
JW136
280
T
PAD
o
( C) 260
240
220
200
180
160
140
120
100
80
0
50
100
150
200
t (s)
250
(1)
(1) Maximum permissible reflow temperature.
Fig.4
Maximum temperature load during infrared reflow soldering
measured on the soldering pad.
2001 Jul 05
5
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
