Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SPW35N60CFD
MA000363361
PG-TO247-3-41
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
antimony
silver
tin
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
Issued
Weight*
Weight
[mg]
23.680
3.972
1.192
3967.074
4.415
19.843
377.024
1587.471
31.874
29.065
0.891
2.226
5.788
Average
Mass
[%]
0.39
0.07
0.02
65.51
0.07
0.33
6.23
26.22
0.53
0.48
0.01
0.04
0.10
29. August 2013
6054.52 mg
Sum
[%]
0.39
Average
Mass
[ppm]
3911
656
197
65.60
0.07
655226
729
3277
62272
32.78
0.53
0.48
262196
5265
4800
147
368
0.15
956
1471
1000000
327745
5265
4800
656079
729
Sum
[ppm]
3911
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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