Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SAK-XC2787X-200F100L AB
MA001035938
PG-LQFP-144-13
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
71.686
0.126
0.503
10.062
408.558
4.202
4.767
128.714
819.955
9.120
2.462
3.600
10.800
Average
Mass
[%]
4.86
0.01
0.03
0.68
27.71
0.28
0.32
8.73
55.62
0.62
0.17
0.24
0.73
29. August 2013
1474.56 mg
Sum
[%]
4.86
Average
Mass
[ppm]
48616
85
341
6824
28.43
0.28
277072
2850
3233
87290
64.67
0.62
0.17
556070
6185
1669
2441
0.97
7324
9765
1000000
646593
6185
1669
284322
2850
Sum
[ppm]
48616
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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