Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE8203E
MA001113312
PG-DSO-36-50
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
8.642
0.057
0.227
4.546
184.568
2.343
0.801
36.831
362.704
5.440
0.791
0.583
1.749
Average
Mass
[%]
1.42
0.01
0.04
0.75
30.29
0.38
0.13
6.04
59.53
0.89
0.13
0.10
0.29
29. August 2013
609.28 mg
Sum
[%]
1.42
Average
Mass
[ppm]
14185
93
373
7461
31.09
0.38
302928
3845
1314
60450
65.70
0.89
0.13
595297
8929
1298
957
0.39
2870
3827
1000000
657061
8929
1298
310855
3845
Sum
[ppm]
14185
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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