TAO-3530
2
1
2
3
System on Module
TI OMAP 3530 application processor with
ARM Cortex-A8 CPU, integrated DSP and
POWERVR SGX 530 for 2D and
3D graphics acceleration.
Flexible expansion possibilities by two
100 pin NAIS board to board connectors to
customize your own interfaces on
base boards at low cost.
4
5
System
CPU
DSP core
PMIC
Memory
Storage
Wireless LAN
Supported OS
TI OMAP 3530 @ 600MHz (1)
TMS320C64x+
TM
@ 430MHz
TPS65930 (5)
256 MB Low power mobile DDR (2)
512 MB NAND Flash (3)
Marvell 8686 802.11b/g (4)
Linux 2.6.x, Windows CE 6, Android
Dimensions
units in mm
63.5
Graphic Capabilities
Chipset
API support
58
POWERVR SGX 530
10Mpolys/s, up to 720p resolution
OpenGL 2.0, OpenGLes 1.1,
OpenVG 1.0
Order Information
2012-01. All specifications are subject to change without notice.
Power
Power consumption
Standby
Input power
<2.0 Watt with Wireless enabled
<50 mWatt
5V, 4.2V
TAO-3530
TAO-3530-i
TAO-3530W
Environmental and Mechanical
Temperature
Humidity
Dimensions
MTBF
Weight
Shock
Vibration
OMAP3530 System on Module
OMAP3530 System on Module
with industrial temperature
specifications (MOQ’s apply)
OMAP3530 system on module
with Wireless LAN
Commercial: 0° to 70° C
Extended: -20° to 70° C (no wifi)
Industrial: -40° to 85° C (no wifi)
10-90%
63.5 x 35 x 6.4 mm
2½ x 1⅜ x ¼ inch
>100,000 hours
10 grams
50G / 25ms
20G / 0-600 Hz
Development kits available
Phone: +886-2-8227-3585
E-mail: sales@technexion.com
Web:
http://www.technexion.com
29.5
M2
Interfaces
Connectors
two 100 pin NAIS connectors
SPI, UART, USB host, USB OTG/
client, I
2
C, PWM lines, 1-wire,
MMC lines, A/D lines, camera,
audio in/out/mic, S-Video, Display
35
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