Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.82uF, Surface Mount, 1210, CHIP
| 参数名称 | 属性值 |
| Objectid | 7042715954 |
| 包装说明 | , 1210 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 电容 | 0.82 µF |
| 电容器类型 | CERAMIC CAPACITOR |
| 介电材料 | CERAMIC |
| 高度 | 2.8 mm |
| 长度 | 3.4 mm |
| 安装特点 | SURFACE MOUNT |
| 多层 | Yes |
| 负容差 | 5% |
| 端子数量 | 2 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装形式 | SMT |
| 包装方法 | WAFFLE PACK |
| 正容差 | 5% |
| 额定（直流）电压（URdc） | 25 V |
| 参考标准 | ESCC3009/041 |
| 尺寸代码 | 1210 |
| 表面贴装 | YES |
| 温度特性代码 | X7R |
| 温度系数 | 15% ppm/°C |
| 端子形状 | WRAPAROUND |
| 宽度 | 2.7 mm |
| 300904105824JA | 300904104334JE | 300904104564KA | 300904102123MC | 300904103682MX | |
|---|---|---|---|---|---|
| 描述 | Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.82uF, Surface Mount, 1210, CHIP | Ceramic Capacitor, Multilayer, Ceramic, 100V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.33uF, Surface Mount, 1206, CHIP | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.56uF, Surface Mount, 1206, CHIP | Ceramic Capacitor, Multilayer, Ceramic, 50V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.012uF, Surface Mount, 0603, CHIP | Ceramic Capacitor, Multilayer, Ceramic, 16V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.0068uF, Surface Mount, 0805, CHIP |
| Objectid | 7042715954 | 7042715671 | 7042715741 | 7042715019 | 7042715467 |
| 包装说明 | , 1210 | , 1206 | , 1206 | , 0603 | , 0805 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 电容 | 0.82 µF | 0.33 µF | 0.56 µF | 0.012 µF | 0.0068 µF |
| 电容器类型 | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR |
| 介电材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 高度 | 2.8 mm | 1.8 mm | 1.8 mm | 1 mm | 1.52 mm |
| 长度 | 3.4 mm | 3.4 mm | 3.4 mm | 1.75 mm | 2.2 mm |
| 安装特点 | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT |
| 多层 | Yes | Yes | Yes | Yes | Yes |
| 负容差 | 5% | 5% | 10% | 20% | 20% |
| 端子数量 | 2 | 2 | 2 | 2 | 2 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装形式 | SMT | SMT | SMT | SMT | SMT |
| 包装方法 | WAFFLE PACK | WAFFLE PACK | WAFFLE PACK | WAFFLE PACK | WAFFLE PACK |
| 正容差 | 5% | 5% | 10% | 20% | 20% |
| 额定（直流）电压（URdc） | 25 V | 100 V | 25 V | 50 V | 16 V |
| 参考标准 | ESCC3009/041 | ESCC3009/041 | ESCC3009/041 | ESCC3009/041 | ESCC3009/041 |
| 尺寸代码 | 1210 | 1206 | 1206 | 0603 | 0805 |
| 表面贴装 | YES | YES | YES | YES | YES |
| 温度特性代码 | X7R | X7R | X7R | X7R | X7R |
| 温度系数 | 15% ppm/°C | 15% ppm/°C | 15% ppm/°C | 15% ppm/°C | 15% ppm/°C |
| 端子形状 | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND |
| 宽度 | 2.7 mm | 1.8 mm | 1.8 mm | 0.95 mm | 1.45 mm |
| 自定义功能 | - | TAPE & REEL AVAILABLE UPON REQUEST | TAPE & REEL AVAILABLE UPON REQUEST | TAPE & REEL AVAILABLE UPON REQUEST | - |
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