Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IDH05S60C
MA000800252
PG-TO220-2-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
siliconcarbide
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
409-21-2
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
1.974
0.753
0.226
751.797
1.329
9.078
99.854
496.246
14.487
0.198
0.000
0.076
0.061
2.905
0.177
0.590
589.466
Average
Mass
[%]
0.10
0.04
0.01
38.18
0.07
0.46
5.07
25.20
0.74
0.01
0.00
0.00
0.00
0.15
0.01
0.03
29.93
29. August 2013
1969.22 mg
Sum
[%]
0.10
Average
Mass
[ppm]
1002
382
115
38.23
0.07
381774
675
4610
50708
30.73
0.74
252001
7357
101
0.01
0
39
31
0.15
1475
90
300
29.97
299340
299730
1000000
1545
101
307319
7357
382271
675
Sum
[ppm]
1002
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com