High Performance Flash PLD
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP20,.4 |
| 针数 | 20 |
| Reach Compliance Code | unknow |
| 其他特性 | 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK |
| 架构 | PAL-TYPE |
| 最大时钟频率 | 37 MHz |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e0 |
| 长度 | 12.8 mm |
| 专用输入次数 | 8 |
| I/O 线路数量 | 8 |
| 输入次数 | 18 |
| 输出次数 | 8 |
| 产品条款数 | 64 |
| 端子数量 | 20 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 8 DEDICATED INPUTS, 8 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP20,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 5 V |
| 可编程逻辑类型 | FLASH PLD |
| 传播延迟 | 25 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 | 5.25 V |
| 最小供电电压 | 4.75 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 7.5 mm |
| ATF16V8B-25SC | ATF16V8B-25JI | ATF16V8B-25PC | ATF16V8B-25PI | ATF16V8B-25SI | ATF16V8B-7SC | ATF16V8B-25JC | |
|---|---|---|---|---|---|---|---|
| 描述 | High Performance Flash PLD | High Performance Flash PLD | High Performance Flash PLD | High Performance Flash PLD | High Performance Flash PLD | High Performance Flash PLD | High Performance Flash PLD |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | SOIC | QLCC | DIP | DIP | SOIC | SOIC | QLCC |
| 包装说明 | SOP, SOP20,.4 | QCCJ, LDCC20,.4SQ | DIP, DIP20,.3 | DIP, DIP20,.3 | SOP, SOP20,.4 | SOP, SOP20,.4 | QCCJ, LDCC20,.4SQ |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | compli | unknow |
| 其他特性 | 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK |
| 架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| 最大时钟频率 | 37 MHz | 37 MHz | 37 MHz | 37 MHz | 37 MHz | 100 MHz | 37 MHz |
| JESD-30 代码 | R-PDSO-G20 | S-PQCC-J20 | R-PDIP-T20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | S-PQCC-J20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 12.8 mm | 8.9662 mm | 25.9 mm | 25.9 mm | 12.8 mm | 12.8 mm | 8.9662 mm |
| 专用输入次数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| I/O 线路数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 输入次数 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
| 输出次数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 产品条款数 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C |
| 组织 | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | QCCJ | DIP | DIP | SOP | SOP | QCCJ |
| 封装等效代码 | SOP20,.4 | LDCC20,.4SQ | DIP20,.3 | DIP20,.3 | SOP20,.4 | SOP20,.4 | LDCC20,.4SQ |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | SMALL OUTLINE | CHIP CARRIER | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 240 | 225 | NOT SPECIFIED | NOT SPECIFIED | 240 | NOT SPECIFIED | 225 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 可编程逻辑类型 | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD |
| 传播延迟 | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 9 ns | 25 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | 4.57 mm | 5.33 mm | 5.33 mm | 2.65 mm | 2.65 mm | 4.57 mm |
| 最大供电电压 | 5.25 V | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V |
| 最小供电电压 | 4.75 V | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | J BEND | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.5 mm | 8.9662 mm | 7.62 mm | 7.62 mm | 7.5 mm | 7.5 mm | 8.9662 mm |
| 厂商名称 | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | - | - |
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