Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE42764DV
MA001375570
PG-TO252-5-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
3.179
0.205
0.061
204.243
0.182
0.296
13.630
134.230
5.136
0.076
0.000
0.119
0.095
4.552
Average
Mass
[%]
0.87
0.06
0.02
55.81
0.05
0.08
3.72
36.67
1.40
0.02
0.00
0.03
0.03
1.24
15. June 2015
366.01 mg
Sum
[%]
0.87
Average
Mass
[ppm]
8685
559
168
55.89
0.05
558032
499
810
37241
40.47
1.40
366742
14032
208
0.02
1
326
260
1.30
12437
13023
1000000
208
404793
14032
558760
499
Sum
[ppm]
8685
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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