MIC-6313
Preliminary
OpenVPX CPU Blade with Intel
®
4th/ 5th
Generation Core
®
Processor
Features
5th Generation Intel
®
Core
®
processor, up to 4 cores / 8 threads
Intel
®
QM87 PCH
Triple independent display support
OpenVPX MOD6-PAY-4F1Q2U2T-12.2.1-2 profile compliant
Onboard and SO-DIMM DDR3L-1600, up to 16 GB, with ECC support
Four SRIOx4 ports and two PCIex8 ports on Fabric interface
Four 1000BASE-T ports on Base interface (two configurable to SERDES)
Two 1000BASE-T front panel ports
One CFast and one onboard flash storage device
RoHS
COMPLIANT
2002/95/EC
Introduction
The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the Intel
®
4th/ 5th Generation Core
®
and Xeon
®
E3 Lv4 embedded platform. To enable the
highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to
5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the
VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and
additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining
maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the Intel
®
4th/ 5th Generation Core
®
and Xeon
®
E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with
outstanding floating point and vector processing performance.
Tailored for rugged environments, the MIC-6313 has a native conduction-cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink,
additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a cost-efficient,
modular storage. By using Intel’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard
XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data
rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by intel’s latest Gigabit Ethernet controller.
Intel’s next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented
by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides
media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE
ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.
Specifications
Processor System
CPU
Max. Speed
Chipset
BIOS
Technology
Max. Capacity
Socket
P1
P2
P4
P5
P6
Controller
Controller
Serial (COM)
Ethernet
USB
Miscellaneous
Compatibility
CFast
Onboard Flash
Consumption
PCB Dimensions
Weight
Intel E3-12x8Lv4/ i7-5xx0EQ / i5-4402E
3.3 GHz
Intel Lynx Point (QM87)
Redundant AMI UEFI based 8MByte SPI flash
Dual channel DDR3L 1600MHz w/ ECC
Configurable up to 16 GB
8GB memory soldered onboard, 1x 204-pin SODIMM socket max. to 8GB
4x SRIOx4 Gen2
2x PCIex8 (1 port NT Capable)
8d+12d XMC IO;, 2x 10/100/1000BT (alternative of SerDes) from I350
2x USB3.0; 2x USB 2.0; 3x SATA-III; DVI x2; 2x UART(RS-232/422/485 switchable)
2x 10/100/1000BT; Audio from ALC892; 2x USB 2.0; KB/Mouse from SIO;1x SATA II
Intel embedded graphic controller Iris (3 independent displays)
Intel I350-AM4 Quad Port Gigabit Ethernet Controller to backplane; 2x I210 to front panel
1 RS-232 on RJ-45 connector,
2 x RJ-45 10/100/1000BASE-T
2x USB 3.0, 1x USB2.0
XMC, DVI
Linux; Windows7
SATA III
64G SATAII
To-be-measured W total power envelope with 47W CPU
6HP, 233.35 x 160 mm (9.2" x 6.3") (W x D)
0.95kg without peripherals
Memory
VPX Interface
Graphics
Ethernet
Front I/O Interface
Operating System
Storage
Power Requirement
Physical Characteristics
All product specifications are subject to change without notice
Last updated : 28-Oct-2015
MIC-6313
Specifications (Cont.)
Temperature
Environment
Humidity
Bump
Vibration (5 ~ 500 Hz)
Altitude
VPX
Safety
EMC
Operating (with TBD CFM airflow)
Non-operating
Grade 1: 0 ~ 55° C
-40 ~ 85° C
Grade 2: -40 ~ 85° C*
95% @ 40° C, non-condensing
95% @ 60° C, non-condensing
40G, 6ms (conduction cooled)
25G, 6ms (Air cooled)
4.4Grms (conduction cooled)
2Grms (Air cooled)
50,000ft @ -40° C above sea level
OpenVPX (VITA 65), REDI (VITA 48), IPMI 2.0
FCC class A, CE, RoHS
FCC47 CFR Part15, Class A, CE Mark (EN55022/EN55024/EN300386)
Compliance
Block Diagram
Power+IPMB
2x PCIex4
P0
8GB DDR3 onboard
8GB DDR3 onboard
1600 w/ ECC
1600 w/ ECC
Intel
Broadwell-H
4/2 Core / GT2
ECC/BGA
PCIE to
SRIO bridge
PCIE gen3
switch
to P5
SRIO Gen2 x4
SRIO Gen2 x4
SRIO Gen2 x4
SRIO
switch
SRIO Gen2 x4
SRIO Gen2 x4
SRIO Gen2 x4
PCIex8
DVI
P1
2x PCIex8
(NT selectable on one port)
PCIex8
NC-SI from BMC
PCIex4
DVI-D
P2
Intel
GbE NIC
NC-SI
2x PCIex1
Intel PCH
GPIOx16 to P2, P4, P6
P3
(N/A)
XMC
8d +12d XMC IO
2x 1GBase-T
(SERDES selectable)
2x 1GBase-T
P6
Intel QuadGbE
LPC
SATAII (3Gbps)
USB 2.0 (3x)
to P6
Intel Quad
GbE NIC
From FPGA
P4
BMC
TPM
UART x2
UART (2x)
SATAIII (6Gbps)
to P6
USB 2.0 (2x)
USB 2.0 / 3.0
USB 2.0 / 3.0
USB 2.0
Onboard
Flash
3x SATAIII (6Gbps)
Audio
SATAII (3Gbps)
USB 3.0 (2x)
From CPU
DVI x2
P5
SPI / UART
RS232
FPGA
UART (2x)
to RTM
codec
From Quad GbE
Line-in
Line-out
MIC
2x 1GBase-T
USB 2.0 (3x)
KB/MS
UART (2x)
P6
or
From PCH
From SIO
From SIO
Daughter board
Front Panel
Part Number
MIC-6313-A1A4E
MIC-6313-B1C4E
Display
DVI x1
VGA x1
USB
2.0x1; 3.0x2
3.0x2
Ethernet
(RJ45)
2
0
Console
(RJ45)
1
0
Main On-board Features
Onboard
CPU
Memory
E3-1278Lv4 8GB
i5-4402E
8GB
Onboard
Flash
64GB
64GB
External
storage
CFast Socket
SSD site
SODIMM
Socket
Yes
No
IPMI
management
No
Yes
Ordering Information**
Model number
MIC-6313-A1A4E
MIC-6313-B2C4E
Configuration
MIC-6313 with E3-12x8Lv4, Air-cooled heat sink, 64G
onboard flash
MIC-6313 with i5-4402E, conduction-cooled heat sink,
64G onboard flash, 2.5" SSD carrier.
One CFast Socket
Memory SODIMM socket
*: For the Grade 2 wide temperature SKU availability, please contact your local sales office.
**: For the other Intel 4th/5th generation Core family CPU availability, please contact your
local sales office.
VITA and OpenVPX Logo are trademarks of VITA
Front panel (From left to right):
Two RJ-45 (GbE)
One passive CPU heat sink
USB2.0
Two USB3.0
XMC
RJ-45 (console)
DVI
Online Download
www.advantech.com/products
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