NJW4810A
Dual Half Bridge Driver
GENERAL DESCRIPTION
The NJW4810A is a general-purpose dual half bridge driver
capable of supplying 1A current. Output duty=100% can be
operated by high side P channel MOSFET. It can use as a full
bridge driver by connecting VDD1 and VDD2.
The internal gate driver drives high-side/low-side power
MOSFET; therefore, it is able to fast switching.
Additionally, it has protection features such as over current
protection and thermal shutdown. And in the case of failure, it
can output a fault flag.
It is suitable for power switching applications of DSP/micro
controller.
FEATURES
Output Switch Current
1A
Operating Voltage
8.0V to 40V
Thermal Shut Down
Over Current Protection
Under Voltage Lockouts
Fault Indicator Output
High Heat Radiation Package
Package Outline
HSOP8
■
PACKAGE OUTLINE
NJW4810AGM1
■PIN
CONFIGURATION
1
2
3
4
8
7
6
5
1. IN2
2. IN1
3. VDD1
4. OUT1
5. GND
6. OUT2
7. VDD2
8. FLT
Exposed PAD on
backside connect to GND
Ver.2015-02-10
-1-
NJW4810A
BLOCK DIAGRAM
VDD1
VDD2
Under Voltage
Lock Out
Level Shift
High Side
Gate Driver
High Side
Gate Driver
Level Shift
FLT
Thermal
Shut Down
Over Current
Protection
OUT1
OUT2
Low Side
Gate Driver
Low Side
Gate Driver
IN1
Control
Logic
IN2
GND
-2-
Ver.2015-02-10
NJW4810A
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Supply Voltage
Input Voltage
FLT pin Voltage
FLT pin Current
Power Dissipation
Operating Junction Temperature
Operating Temperature Range
Storage Temperature Range
V
+
1, V
+
2
V
IN
V
FLT
I
FLT
P
D
T
j
T
opr
T
stg
MAXIMUM RATINGS
45
0.3
to
6
0.3
to
6
1
0.9 (*1)
3.1 (*2)
40
to
150
40
to
85
50
to
150
UNIT
V
V
V
mA
W
C
C
C
(Ta=25°C)
REMARKS
VDD1-GND pin
VDD2-GND pin
IN1-GND pin
IN2-GND pin
FLT-GND pin
–
–
–
–
(*1): Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 2Layers)
(*2): Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 4Layers)
(For 4Layers: Applying 74.2×74.2mm inner Cu area and a thermal via hole to a board based on JEDEC standard JESD51-5)
RECOMMENDED OPERATING CONDITIONS
PARAMETER
SYMBOL
MIN.
+
V1
Operating Voltage
8
V
+
2
Output Switch Current
I
OM
0
Input Voltage
V
IN
0
FLT pin Voltage
V
FLT
0
TYP.
–
–
–
–
MAX.
40
1
5.5
5.5
UNIT
V
A
V
V
(Ta=25°C)
REMARKS
VDD1-GND pin
VDD2-GND pin
OUT1, OUT2 pin
IN1-GND pin, IN2-GND pin
FLT-GND pin
Ver.2015-02-10
-3-
NJW4810A
THERMAL CHARACTERISTICS
PARAMETER
Junction-to-
Ambient Temperature
Junction-to-Case
SYMBOL
ja
jt
THERMAL
RESISTANCE
139 (*1)
40 (*2)
19 (*1)
3.7 (*2)
UNIT
C/W
C/W
(*1): Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 2Layers)
(*2): Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 4Layers)
(For 4Layers: Applying 74.2×74.2mm inner Cu area and a thermal via hall to a board based on JEDEC standard JESD51-5)
Power Dissipation vs. Ambient Temperature
4
(mW)
3.5
3
2.5
2
1.5
1
0.5
0
-50
-25
0
25
50
75
100
o
Ambient Temperature Ta ( C)
At on 2 layer PC Board
(Topr=-40~+85 C, Tj=
~150
C)
At on 4 layer PC Board
o
o
Power Dissipation P
D
-4-
Ver.2015-02-10
NJW4810A
ELECTRICAL CHARACTERISTICS
PARAMETER
General Characteristics
Quiescent Current 1 (Operating)
Quiescent Current 2 (Switching)
I
Q1
I
Q2
V
IN1
=V
IN2
=0V
V
IN1
=V
IN2
=0V to 3V,
f
IN1
= f
IN2
=750kHz
antiphase 50% Duty Cycle
V
+
1
V
+
2
V
+
1
V
+
2
–
–
–
–
0.9
0.3
3.7
3.2
1.7
0.8
5.5
5.0
mA
mA
SYMBOL
(Unless otherwise noted, V
+
1= V
+
2=12V, Ta=25C)
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Output Block
High-side SW ON Resistance
Low-side SW ON Resistance
Over Current Limit (*3)
Over Current Limit
Protection Time
(*3)
R
DSH
R
DSL
I
LIMIT
t
OCP
tr
tf
Dt
t
d_ON
t
d_OFF
Output Rise Time
Output Fall Time
Dead Time
Output Rise Delay Time
Output Fall Delay Time
I
OSOURCE
=600mA
I
OSINK
=600mA
High-side and Low-side
High-side and Low-side
R
FLT
=47k, V
FLT
=5V
V
IN1
=V
IN2
= 0 to 3V
V
IN1
=V
IN2
= 3 to 0V
V
IN1
=V
IN2
= 0 to 3V
V
IN1
=V
IN2
= 0 to 3V
V
IN1
=V
IN2
= 3 to 0V
–
–
1
15
–
–
–
–
–
1.0
0.75
2
30
3
5
50
120
120
1.8
1.3
3
80
–
–
–
–
–
A
ms
ns
ns
ns
ns
ns
High-side SW Leak Current
V
1=V
2=5.5V,
I
OLEAKOUTH
–
–
1
A
at OFF state
V
OUT1
=V
OUT2
=0V
Low-side SW Leak Current
V
1=V
2=5.5V,
I
OLEAKOUTL
–
–
1
A
at OFF state
V
OUT1
=V
OUT2
=5.5V
OUT pin
–
VDD pin
V
PDOV
I
ORH
=1A, V
1=V
2=5.5V
–
0.9
1.5
V
Potential Difference
GND pin
–
OUT pin
V
PDGO
I
ORL
=1A, V
1=V
2=5.5V
–
0.9
1.5
V
Potential Difference
(*3): The overcurrent detection time may take 1s (max). During this time overcurrent protection circuit does not detect
an overcurrent. Therefore, you should control the pulse width and frequency of IN1/IN2 pin to prevent a continuous
over-current in short-term.
Input Circuit Block
Input pin High Voltage
Input pin Low Voltage
Input pin sink current
V
IHIN
V
ILIN
I
IIN
V
IN1
=V
IN2
= 5.5V
2.0
0
–
–
–
0.01
5.5
0.8
1
V
V
A
Under Voltage Lockout (UVLO) Block
UVLO Release Voltage (*4)
V
UVLO2
V
1=V
2=LH
UVLO Operation Voltage (*4)
V
UVLO1
V
1=V
2=HL
UVLO Hysteresis Voltage
ΔV
UVLO
V
UVLO2
-V
UVLO1
(*4): UVLO operates at each line (V
1 and V
2)
Fault Function (FLT pin)
Low Level Output Voltage
OFF Leak Current
V
LFLT
I
OLEAKFLT
6.3
6.0
–
7.0
6.7
0.3
7.7
7.4
–
V
V
V
I
FLT
=500A
V
1=V
2=5.5V, V
FLT
=5.5V
–
–
0.25
–
0.5
1
V
A
Ver.2015-02-10
-5-
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