arsenide flip chip Schottky barrier diode. This de-
vice is fabricated on OMCVD epitaxial material using
a process designed for high device uniformity and
extremely low parasitics. This diode is fully pas-
sivated with silicon nitride and has an additional
layer of polyimide for scratch protection. The protec-
tive coating prevents damage to the junction during
automated or manual handling. The flip chip con-
figuration is suitable for pick and place insertion.
This device with can be attached with solder or con-
ductive epoxy. The high cutoff frequency of this di-
ode allows use through millimeter wave frequencies.
Typical applications include single and double bal-
anced mixers in PCN transceivers and radios, police
radar detectors, and automotive radar detectors.
Part Number
MADS-001317-1500AG
MADS-001317-1500AP
Package
Gel Pack
Pocket Tape and Reel
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADS-001317-1500
Solderable GaAs Flip Chip Schottky Diode
Rev. V4
Electrical Specifications @ + 25 °C
Parameters and Test Conditions
Symbol
Cj
Ct
Rs
Vf1
Vbr
Units
Min.
pF
pF
Ohms
Volts
Volts
.60
4.5
.030
MADS-001317-1500
Typ.
.020
.045
4
.70
7
.060
7
.80
Max.
Junction Capacitance at 0V at 1 MHz
Total Capacitance at 0V at 1 MHz
1
Dynamic Resistance at 9.5 - 10.5mA
Forward Voltage at +1mA
Reverse Breakdown Voltage at -10uA
Notes:
1. Total capacitance is equivalent to the sum of junction capacitance Cj and parasitic capacitance Cp.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADS-001317-1500
Solderable GaAs Flip Chip Schottky Diode
Rev. V4
Forward Current vs Temperature
100.00
Forward Current (mA)
+125°C
25°C
- 50°C
10.00
1.00
0.10
0.01
0.00
0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00
Forward Voltage (V)
Absolute Maximum Ratings
1
Parameter
Operating Temperature
Storage Temperature
Incident LO Power
Incident RF Power
Mounting Temperature
Electrostatic Discharge ( ESD ) Classification
2
Absolute Maximum
-65 °C to +125 °C
-65 °C to +150 °C
+20 dBm
+20 dBm .
+260 °C
Class 0
1. Operation of this device above any one of these parameters may cause permanent damage.
2. Human Body Model
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADS-001317-1500
Solderable GaAs Flip Chip Schottky Diode
Rev. V4
Mounting Techniques
Die attach for these devices is made simple through the use of surface mount die attach technology.
This chip was designed to be inserted onto hard or soft substrates with the junction side down. This chip can be
mounted with conductive epoxy or with solder.
Solder Die Attach:
This device can be mounted with Sn63/Pb37 or RoHS compliant solder.
Typical reflow profiles are provided on M/A-Com application note M538, “ Surface Mounting Instructions”
which can be found @ www.macomtech.com
Epoxy Die Attach:
This device can also be attached with conductive epoxy. The assembly can be preheated to 125 - 150°C.
Use a minimum amount of epoxy. Cure epoxy as per manufacturer’s instructions.
Handling Procedures
The following precautions should be observed to avoid damaging these chips:
Cleanliness:
The chips should be handled in a clean environment.
Do not attempt to clean die after installation.
Static Sensitivity:
Schottky barrier diodes are ESD sensitive and can be damaged by static
electricity. Proper ESD techniques should be used when handling these devices.
General Handling:
The protective polymer coating on the active areas of these die provides scratch
protection, particularly for the metal air bridge which contacts the anode. Die can
be handled with tweezers or vacuum pickups and are suitable for use with
automatic pick-and-place equipment.
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADS-001317-1500
Solderable GaAs Flip Chip Schottky Diode
Rev. V4
Flip Chip Outline Drawing
1. Pad finish is .2 microns of gold over 4 microns of nickel.
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
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