This device is a silicon, glass PIN diode surmount chip
fabricated with M/A-COM Technology Solutions patented
HMIC
TM
process. This device features two silicon pedes-
tals embedded in a low loss, low dispersion glass. The
diode is formed on the top of one pedestal and connec-
tions to the backside of the device are facilitated by mak-
ing the pedestal sidewalls electrically conductive. Selective
backside metallization is applied producing a surface
mount device. This vertical topology provides for excep-
tional heat transfer. The
topside is fully encapsulated
with silicon nitride and has an additional polymer layer for
scratch and impact protection. These protective coatings
prevent damage to the junction and the anode air-bridge
during handling and assembly.
Applications
These packageless devices are suitable for usage in
moderate incident power, ≤ 50dBm/C.W. or where the
peak power is ≤ 75dBm, pulse width is ≤ 1μS, and duty
cycle is ≤ 0.01%. Their low parasitic inductance, 0.4 nH,
and excellent RC constant, make these devices a superior
choice for higher frequency switch elements when
compared to their plastic package counterparts
.
Chip Dimensions
DIM
A
B
C
D
E
F
G
Notes:
1) Backside metal: 0.1microns thick.
2) Yellow area with hatch lines indicate backside ohmic gold
contacts.
3) Both devices have same outline dimensions ( A to G).
INCHES
Min
Max
Min
MM
Max
0.060
0.031
0.004
0.019
0.019
0.019
0.029
0.062
0.032
0.008
0.021
0.021
0.021
0.031
1.525
0.775
0.102
0.475
0.475
0.475
0.725
1.575
0.825
0.203
0.525
0.525
0.525
0.775
Absolute Maximum Ratings
1
@T
AMB
= +25°C
(unless otherwise specified)
Parameter
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
C.W. Incident Power
Mounting Temperature
Absolute Maximum
500 mA
- 115 V
-55°C to +125°C
-55 °C to +150°C
+175°C
50dBm
+280°C for 30 seconds
1) Exceeding these limits may cause in permanent damage
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-017015-1314
MADP-030015-1314
SURMOUNT™ 15μM PIN Diodes
RoHS Compliant
Electrical Specifications @ T
A
= 25°C
(unless otherwise noted)
Parameter
Symbol
Conditions
Units
Min
Typ
Ma
x
0.3
8
Min
Typ
Max
Rev. V6
MADP-017015
Capacitance
Capacitance
Capacitance, 85°C
Resistance
Resistance
Resistance, 85°C
Resistance, 85°C
Forward Voltage
Reverse Leakage
Current
Third Order
Intercept Point
Thermal
Resistance
Lifetime
C
T
C
T
C
T
R
S
R
S
R
S
R
S
V
F
I
R
3
MADP-030015
0.79
0.78
0.76
0.49
0.38
0.82
0.69
0.85
-40 V, 1 MHz
1,3
-40V, 1 GHz
1,3
-40 V, 1 GHz
1,3
+10 mA, 1 GHz
2,3
+70 mA, 1 GHz
2,3
+10 mA, 1 GHz
2,3
+70 mA, 1 GHz
2,3
+10 mA
-115 V
F1= 1800 MHz
F2 = 1810 MHz
Input Power = 0 dBm
I bias = +70 mA
pF
pF
pF
Ω
Ω
Ω
Ω
V
uA
0.32
0.31
0.29
0.72
0.51
1.08
0.84
0.74
-
0.9
0
10
0.72
-
0.90
10
IP
dBc
-36.8
-
37.
0
13
1.6
θ
T
L
+10 mA / -6 mA
( 50% - 90% V )
°C/W
uS
30
1.3
Notes:
1) Total capacitance, C
T
, is equivalent to the sum of Junction Capacitance ,Cj, and Parasitic Capacitance, Cpar.
2) Series resistance R
S
is equivalent to the total diode resistance : Rs = Rj ( Junction Resistance) + Rc ( Ohmic Resistance)
3) Rs and C
T
are measured on an HP4291A Impedance Analyzer with the die mounted in an ODS-186 package .
4) Theta (θ) is measured with the die mounted in an ODS-186 package .
Typical Spice Parameters @ T
AMB
= +25°C
Spice Parameter
Units
MADP-017015-1314
MADP-030015-1314
N
-
1.1
1.1
RS
1.2
1.1
IS
IK
BV
IBV
Ct CJO
VJ
M FC Cpar_Cj
A
(mA) (Volts) (A) (pF) (pF) (Volts) -
-
(F)
9.8E-15 14.7 145
10 0.46 0.10 0.29 0.50 0.34 3.5E-13
8.5E-15 13.9 145
10 1.12 0.29 0.18 0.50 0.19 8.2E-13
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-017015-1314
MADP-030015-1314
SURMOUNT™ 15μM PIN Diodes
RoHS Compliant
Typical Performance @ T
AMB
= +25°C
Ct vs. V
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
0
10.00
MADP-030015
Rev. V6
Rs vs. I
Rs @ 1GHz (ohm)
Ct @ 1GHz (pF)
1.00
MADP-017015
MADP-017015
MADP-030015
0.10
0.001
10
20
Voltage (V)
30
40
0.01
Current (A)
0.1
Ct vs. Freq.
1.2
1
0.8
0V
10V
40V
0V
10V
40V
MADP-17015
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
MADP-30015
0.2
0.18
0.16
0.14
0.12
0.1
0.08
0.06
0.04
0.02
0
0
0.2
0.4
Ls vs. Freq.
0.6
0.4
0.2
0
Frequency (GHz)
Ls @ 5, 10, 20mA (nH)
Ct (pF)
MADP-17015
MADP-30015
0.6
0.8
1
1.2
1.4
1.6
1.8
Frequency (GHz)
Rs vs. Freq.
1.2
1.0
Rs (ohm)
Ls vs. I
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
0
MADP-017015
Ls @ 1GHz (nH)
5m
A
10mA
20mA
MADP-017015
0.8
0.6
0.4
0.2
0.0
0.0
0.2
5m
A
10mA
20mA
MADP-030015
MADP-030015
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0.02
0.04
0.06
0.08
0.1
Frequency (GHz)
3
Current (A)
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-017015-1314
MADP-030015-1314
SURMOUNT™ 15μM PIN Diodes
RoHS Compliant
Rev. V6
Handling Procedures
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The
use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should
insure that abrasion and mechanical shock are minimized.
Bonding Techniques
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently
located on the bottom surface of these devices and are removed from the active junction locations. These devices are well
suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn, or RoHS compliant solders is
recommended. For applications where the average power is ~1W, conductive silver epoxy may also be used. Cure per
manufacturers recommended time and temperature. Typically 1 hour at 150°C.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. A vacuum tip pick-up tool and a force of
60 to100 grams applied to the top surface of the device is recommended. When soldering to soft substrates, such as Duroid, it
is recommended to use a soft solder at the circuit board to mounting pad interface. Position the die so that its mounting pads
are aligned with the circuit board mounting pads. While applying a downward force perpendicular to the top surface of the die,
apply heat near the circuit trace and diode mounting pad. The solder connection to the two pads should not be made one at a
time as this will create unequal heat flow and thermal stress to the part. Solder reflow should not be performed by causing heat
to flow through the top surface of the die to the back. Since the HMIC glass is transparent, the edges of the mounting pads
can be visually inspected through the die after attachment is completed.
Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders is provided in
Application Note M538
, “Surface Mounting
Instructions“ and can viewed on the MA-COM website @
www.macomtech.com
Ordering Information
Gel Pack
MADP-017015-13140G
MADP-030015-13140G
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-017015-1314
MADP-030015-1314
SURMOUNT™ 15μM PIN Diodes
RoHS Compliant
Rev. V6
M/A-COM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
to any intellectual property rights is granted by this document.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR
INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY
OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN
THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM
customers using or selling MACOM products for use in such applications do so at their own risk and agree to
fully indemnify MACOM for any damages resulting from such improper use or sale.
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
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