电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

SE2593A20-T

产品描述SPECIALTY TELECOM CIRCUIT, PBGA30
产品类别热门应用    无线/射频/通信   
文件大小658KB,共18页
制造商Skyworks(思佳讯)
官网地址http://www.skyworksinc.com
下载文档 详细参数 选型对比 全文预览

SE2593A20-T概述

SPECIALTY TELECOM CIRCUIT, PBGA30

专业电信电路, PBGA30

SE2593A20-T规格参数

参数名称属性值
功能数量1
端子数量30
最小工作温度0.0 Cel
最大工作温度85 Cel
加工封装描述5 X 6 MM, 1 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, LGA-30
状态Active
通信类型TELECOM CIRCUIT
jesd_30_codeR-PBGA-B30
包装材料PLASTIC/EPOXY
ckage_codeTFLGA
包装形状RECTANGULAR
包装尺寸GRID ARRAY, THIN PROFILE, FINE PITCH
seated_height_max1.1 mm
额定供电电压3.3 V
表面贴装YES
温度等级OTHER
端子形式BUTT
端子间距0.6250 mm
端子位置BOTTOM
length6 mm
width5 mm

文档预览

下载PDF文档
DATA SHEET
SE2593A20: Dual-Band 802.11n Wireless LAN Front-End
Preliminary Information
Applications
802.11n, MIMO solutions
IEEE802.11b DSSS WLAN
IEEE802.11g OFDM WLAN
IEEE802.11a OFDM WLAN
Access Points, PCMCIA, PC cards
Product Description
The SE2593A20 is a complete 802.11n WLAN RF
front-end module providing all the functionality of the
power amplifiers, LNA, power detector, T/R switch,
diplexers and associated matching. The SE2593A20
provides a complete 2.4 GHz and 5 GHz WLAN
Multiple Input, Multiple Output (MIMO) RF solution
from the output of the transceiver to the antennas in a
compact form factor.
The receive path is designed to maximize
performance by providing both a low noise amplifier
as well as a bypass state, for use when high power
signals are being received.
Designed for ease of use, all RF ports are matched to
50
to simplify PCB layout and the interface to the
transceiver RFIC. The SE2593A20 also includes a
transmitter power detector for each band with 20 dB
of dynamic range. The power ramp rise/fall time is
less than 0.5
μs.
The device also provides band pass filters for both the
a and b/g bands prior to the input of each 2.4 GHz
and 5 GHz power amplifiers, respectively.
The SE2593A20 packaged in 5mm x 6mm x 1.0mm,
Halogen free, Lead free, ROHS compliant, MSL 3
LGA package.
Features
1 Transmit and 1 receive path architecture for
use as MIMO building block.
All RF ports matched to 50
Integrated 2.4/5 GHz PA, 2.4/5 GHz LNA, TX
Filter, T/R switches and diplexers
Integrated Power Detector
19 dBm O/P Power, 802.11b, 11 Mbits, ACPR =
32 dBc
18 dBm @ 3.0 % EVM, 802.11g, 54 Mbits
16 dBm @ 3.0 % EVM, 802.11a, 54 Mbits
Single supply voltage: 3.3 V ± 10 %
Lead free, halogen free, RoHS compliant, MSL3
plated LGA package, 5 mm x 6 mm x 1.0 mm
Ordering Information
Part No.
SE2593A20
SE2593A20-T *
*
Through Dec
*
From
2008
Package
30 pin LGA
30 pin LGA
30 pin LGA
N/A
Remark
Samples
Tray
Tape and Reel
Evaluation kit
SE2593A20-R *
Jan 2009
SE2593A20-EK1
Skyworks Solutions, Inc.
Phone [781] 376-3000
Fax [781] 376-3100
sales@skyworksinc.com
www.skyworksinc.com
202431A
Skyworks Proprietary Information
Products and Product Information are Subject to Change Without Notice
September 25, 2012
1

SE2593A20-T相似产品对比

SE2593A20-T SE2593A20 SE2593A20-EK1 SE2593A20-R SE2593A20_15
描述 SPECIALTY TELECOM CIRCUIT, PBGA30 SPECIALTY TELECOM CIRCUIT, PBGA30 SPECIALTY TELECOM CIRCUIT, PBGA30 SPECIALTY TELECOM CIRCUIT, PBGA30 SPECIALTY TELECOM CIRCUIT, PBGA30
功能数量 1 1 1 1 1
端子数量 30 30 30 30 30
最小工作温度 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel
最大工作温度 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel
加工封装描述 5 X 6 MM, 1 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, LGA-30 5 X 6 MM, 1 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, LGA-30 5 X 6 MM, 1 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, LGA-30 5 X 6 MM, 1 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, LGA-30 5 X 6 MM, 1 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, LGA-30
状态 Active Active Active Active Active
通信类型 TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
jesd_30_code R-PBGA-B30 R-PBGA-B30 R-PBGA-B30 R-PBGA-B30 R-PBGA-B30
包装材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
ckage_code TFLGA TFLGA TFLGA TFLGA TFLGA
包装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
包装尺寸 GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
seated_height_max 1.1 mm 1.1 mm 1.1 mm 1.1 mm 1.1 mm
额定供电电压 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES
温度等级 OTHER OTHER OTHER OTHER OTHER
端子形式 BUTT BUTT BUTT BUTT BUTT
端子间距 0.6250 mm 0.6250 mm 0.6250 mm 0.6250 mm 0.6250 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
length 6 mm 6 mm 6 mm 6 mm 6 mm
width 5 mm 5 mm 5 mm 5 mm 5 mm

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2005  829  2171  244  1096  33  32  47  51  37 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved