This device is a silicon, glass PIN diode surmount chip
fabricated with M/A-COM Technology Solutions’ patented
HMIC
TM
process. This device features two silicon
pedestals embedded in a low loss, low dispersion glass.
The diode is formed on the top of one pedestal and
connections to the backside of the device are facilitated by
making the pedestal sidewalls electrically conductive.
Selective backside metallization is applied producing a
surface mount device. This vertical topology provides for
exceptional heat transfer. The topside is fully
encapsulated with silicon nitride and has an additional
polymer layer for scratch and impact protection. These
protective coatings prevent damage to the junction and the
anode air-bridge during handling and assembly.
Applications
These packageless devices are suitable for moderate
incident power applications, ≤ 10W/C.W. or where the
peak power is ≤ 52W, pulse width is ≤ 1μS, and duty cycle
is ≤ 0.01%. Their low parasitic inductance, 0.4 nH, and
excellent RC constant
,
make these devices a superior
choice for higher frequency switch elements when
compared to their plastic package counterparts.
DIM
A
B
C
D
E
G
D
E
F
INCHES
MIN.
0.040
0.021
0.004
0.013
0.011
0.013
0.019
MM
MIN.
1.025
0.525
0.102
0.325
0.275
0.325
0.475
MAX.
0.042
0.023
0.008
0.015
0.013
0.015
0.021
MAX.
1.075
0.575
0.203
0.375
0.325
0.375
0.525
Absolute Maximum Ratings
1
@ T
AMB
= +25°C
(unless otherwise specified)
Parameter
MADP-042…-13060
C.W. Incident Power dBm
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
Mounting Temperature
F
G
Absolute Maximum
308
+42
Notes:
908
+39
1. Backside metal: 0.1
μM
thick.
2. Yellow hatched areas indicate backside ohmic gold contacts.
3. All devices have the same outline dimensions ( A to G).
408
+44
508
+43
250 mA
-100 V
-55°C to +125°C
-55°C to +150°C
+175°C
+280°C for 10 seconds
1. Exceeding these limits may cause permanent damage.
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-042XX8-13060 Series
SURMOUNT
TM
8µM PIN Diodes
RoHS Compliant
Electrical Specifications @ T
AMB
= + 25 °C
Parameter
Capacitance
Capacitance
Capacitance
Capacitance
Resistance
Resistance
Forward Voltage
Reverse Leakage
Current
Input Third Order
Intercept Point
C.W. Thermal Resistance
Lifetime
Rev. V2
Symbol
C
T
1,3
C
T
1,3
C
T
1,3
C
T
1,3
R
S
2,3
R
S
2,3
V
F
I
R
IIP
θ
T
L
3
Conditions
- 10V, 1 MHz
1
- 10 V, 1 GHz
- 40 V, 1 GHz
1,3
1
Units
pF
pF
pF
pF
Ω
Ω
V
µA
dBm
°C/W
MADP-042308-13060 MADP-042508-13060
Typ.
0.10
0.10
0.09
0.10
1.38
1.18
0.85
1.00
10
73
145
280
77
115
310
0.20
Max.
0.20
Typ.
0.18
0.19
0.18
0.18
0.97
0.87
0.82
Max.
0.30
0.30
- 40 V, 1 MHz
+ 20 mA, 1 GHz
+ 50 mA, 1 GHz
+ 10 mA
-100V
1,3
2,3
2,3
1.00
10
F 1= 1000 MHz
F2 = 1010 MHz
Input Power = +20 dBm
I bias = + 20 mA
+10 mA / -6 mA
( 50% - 90% V )
nS
Parameter
Capacitance
Capacitance
Capacitance
Capacitance
Resistance
Resistance
Forward Voltage
Reverse Leakage Current
Input Third Order
Intercept Point
C.W. Thermal Resistance
Lifetime
1.
2.
3.
4.
Symbol
C
T
1,3
C
T
1,3
C
T
1,3
C
T
1,3
R
S
2,3
Conditions
- 10 V, 1 MHz
1
- 10 V, 1 GHz
1,3
- 40 V, 1 MHz
+ 20 mA, 1 GHz
+ 10 mA
-100V
F 1= 1000 MHz
F2 = 1010 MHz
Input Power = +20 dBm
I bias = + 20 mA
+10 mA / -6 mA
( 50% - 90% V )
1
Units
pF
pF
pF
pF
Ω
Ω
V
µA
dBm
°C/W
nS
MADP-042408-13060 MADP-042908-13060
Typ.
0.38
0.39
0.36
0.37
0.67
0.61
0.80
1.00
10
81
100
380
66
185
230
0.50
Max.
0.50
Typ.
0.05
0.05
0.04
0.05
3.63
3.02
0.91
Max.
0.15
0.15
- 40 V, 1 GHz
1,3
2,3
R
S
2,3
V
F
I
R
IIP
3
θ
4
T
L
+ 50 mA, 1 GHz
2,3
1.00
10
Total capacitance, C
T
, is equivalent to the sum of junction capacitance ,C
J
, and parasitic capacitance, Cpar.
Series resistance R
S
is equivalent to the total diode resistance : R
S
= R
J
( Junction Resistance) + R
C
( Ohmic Resistance)
R
S
and C
T
are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-1134 package.
Theta (θ) is measured with the die mounted in an ODS-1134 package.
Specifications Subject to Change Without Notice
.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-042XX8-13060 Series
SURMOUNT
TM
8µM PIN Diodes
RoHS Compliant
Typical Performance @ T
AMB
= +25 °C
Ct @ 10V
0.45
0.40
0.35
0.30
Ct (pF)
Rev. V2
Ct @ 40V
0.45
0.40
0.35
0.30
Ct (pF)
042408
042408
0.25
0.20
0.15
0.10
0.05
0.00
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Freq (GHz)
042508
042308
0.25
0.20
0.15
0.10
042508
042308
042908
1.4
1.6
1.8
0.05
0.00
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Freq (GHz)
042908
1.4
1.6
1.8
Ct @ 1GHz
0.60
0.50
0.40
Ct (pF)
Rs @ 1GHz
10.000
042908
042408
Rs (ohm)
042308
1.000
042508
042408
0.30
0.20
0.10
0.00
0
5
10
15
20
Bias (V)
25
30
35
40
042508
042308
042908
0.100
0.001
0.010
Bias (A)
0.100
Rs @ 10mA
5.00
4.50
4.00
3.50
Rs (ohm)
Rs @ 20mA
5.00
042908
4.50
4.00
3.50
Rs (ohm)
042908
3.00
2.50
2.00
1.50
1.00
0.50
0.00
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
Freq (GHz)
042408
042308
042508
3.00
2.50
2.00
1.50
1.00
0.50
0.00
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
Freq (GHz)
042308
042508
042408
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-042XX8-13060 Series
SURMOUNT
TM
8µM PIN Diodes
RoHS Compliant
Handling Procedures
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The
use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should
insure that abrasion and mechanical shock are minimized.
Rev. V2
Bonding Techniques
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently
located on the bottom surface of these devices and are removed from the active junction locations. These devices are well
suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn, or RoHS compliant solders is
recommended. For applications where the average power is ~1W, conductive silver epoxy may also be used. Cure per
manufacturers recommended time and temperature. Typically 1 hour at 150°C.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. A vacuum tip pick-up tool and a force of
60 to100 grams applied to the top surface of the device is recommended. When soldering to soft substrates, such as Duroid, it
is recommended to use a soft solder at the circuit board to mounting pad interface. Position the die so that its mounting pads
are aligned with the circuit board mounting pads. While applying a downward force perpendicular to the top surface of the die,
apply heat near the circuit trace and diode mounting pad. The solder connection to the two pads should not be made one at a
time as this will create unequal heat flow and thermal stress to the part. Solder reflow should not be performed by causing heat
to flow through the top surface of the die to the back. Since the HMIC glass is transparent, the edges of the mounting pads
can be visually inspected through the die after attachment is completed.
Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders is provided in
Application Note M538
, “Surface Mounting
Instructions“ and can viewed on the MA-COM Tech”s website @
www.macomtech.com
Ordering Information
The MADP-042XX8-13060 series of surmounts may be ordered in either gel packs or tape and reeled by adding the
appropriate suffix per the table below. Tape and reel dimensions are provided in
Application Note M513
located on the
M/A-COM website @
www.macomtech.com
.
Part Number
Gel Pack
MADP-042308-13060G
MADP-042408-13060G
MADP-042508-13060G
MADP-042908-13060G
Tape and Reel (Surf Tape)
MADP-042308-13060T
MADP-042408-13060T
MADP-042508-13060T
MADP-042908-13060T
Tape and Reel (Pocket Tape)
MADP-042308-13060P
MADP-042408-13060P
MADP-042508-13060P
MADP-042908-13060P
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-042XX8-13060 Series
SURMOUNT
TM
8µM PIN Diodes
RoHS Compliant
Rev. V2
M/A-COM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
to any intellectual property rights is granted by this document.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR
INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY
OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN
THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM
customers using or selling MACOM products for use in such applications do so at their own risk and agree to
fully indemnify MACOM for any damages resulting from such improper use or sale.
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
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