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MA4P7441F-1091T_15

产品描述Non Magnetic SMQ HIPAX PIN Diode
文件大小573KB,共8页
制造商MACOM
官网地址http://www.macom.com
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MA4P7441F-1091T_15概述

Non Magnetic SMQ HIPAX PIN Diode

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MA4P7441F-1091T
Non Magnetic SMQ HIPAX PIN Diode
Rev. V2
Features
Non-Magnetic Package Suitable for MRI
Applications
Rectangular MELF SMQ Ceramic Package
Hermetically Sealed
Lower Rs for Lower Series Loss
Longer
L
for Lower Intermodulation Distortion
Lower Cj for Higher Series Isolation
Higher Average Incident Power Handling
Capability
Description and Applications
The MA4P7441F-1091T is a surface mountable PIN
diode in a Non-Magnetic ( patent pending ) Metal
Electrode Leadless Faced (MELF) package. The
device incorporates M/A-COM’s proven HIPAX
technology to produce a low inductance ceramic
package with no ribbons or whisker wires. The
package utilizes M/A-COM’s new non- magnetic
plating process to provide an extremely low
permeability, hermetically sealed package.
Incorporated in the package is a passivated PIN
diode that is full face bonded on both the cathode
and anode of the chip to maximize surface area for
lower electrical and thermal resistance. The
MA4P7441F-1091T has been comprehensively
characterized both electrically and mechanically to
ensure repeatable and predictable performance.
This MA4P7441F-1091T Non-Magnetic device is
similar in electrical performance to the
MA4P4001F-1091T Magnetic part number.
The diodes are well suited for use in low loss, low
distortion, and high power switching circuits
applicable for high magnetic field environments from
HF through UHF frequencies. The lower thermal
resistance of this device provides excellent higher
average performance at RF power incident levels up
to 200 watts CW. This device is designed to meet
the most rigorous electrical and mechanical
requirements of MRI testing environments.
Designed for Automated Assembly
These SMQ PIN diodes are designed for high
volume tape and reel assembly. The rectangular
package design provides for highly efficient
automatic pick and place assembly techniques. The
parallel flat surfaces are suitable for key jaw or
vacuum pickup techniques. All solder able surfaces
are tin plated and compatible with reflow and vapor
phase soldering methods.
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support

 
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