Reliable, Multilayer Metalization with a Diffusion
Barrier, 100% Stabilization Bake (300°C,
16 hours)
Rev. V5
Case Style 1112
A
A
B
Description
The MA4E2508 SURMOUNT
TM
Anti-Parallel Diode
Series are Silicon Low, Medium, & High Barrier
Schottky Devices fabricated with the patented
Heterolithic Microwave Integrated Circuit (HMIC)
process. HMIC circuits consist of Silicon pedestals
which form diodes or via conductors embedded in a
glass dielectric, which acts as the low dispersion,
low loss, microstrip transmission medium. The
combination of silicon and glass allows HMIC
devices to have excellent loss and power dissipation
characteristics in a low profile, reliable device.
The Surmount Schottky devices are excellent
choices for circuits requiring the small parasitics of a
beam lead device coupled with the superior
mechanical performance of a chip. The SurMount
structure employs very low resistance silicon vias to
connect the Schottky contacts to the metalized
mounting pads on the bottom surface of the chip.
These devices are reliable, repeatable, and a lower
cost performance solution to conventional devices.
They have lower susceptibility to electrostatic dis-
charge than conventional beam lead Schottky
diodes.
The multi-layer metalization employed in the
fabrication of the Surmount Schottky junctions
includes a platinum diffusion barrier, which permits
all devices to be subjected to a 16-hour
non-operating stabilization bake at 300°C.
The “0502” outline allows for Surface Mount
placement and multi- functional polarity orientations.
C
D
E
D
Case Style 1112
INCHES
DIM
MIN.
A
B
C
D Sq.
E
0.0445
0.0169
0.0040
0.0128
0.0128
MAX.
0.0465
0.0189
0.0080
0.0148
0.0148
MIN.
1.130
0.430
0.102
0.325
0.325
MAX.
1.180
0.480
0.203
0.375
0.375
MILLIMETERS
Equivalent Circuit
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MA4E2508 Series
SURMOUNT
TM
Low, Medium, & High Barrier Silicon
Schottky Diodes: Anti-Parallel Pair
Rev. V5
Low Barrier = MA4E2508L, Medium Barrier = MA4E2508M, High Barrier = MA4E2508H
Electrical Specifications: T
A
= +25°C
1,2
Model Number
Barrier
Recommended
Freq. Range
(GHz)
DC - 18
DC - 18
DC - 18
V
F
@ 1 mA
(mV)
330 max.
300 typ.
470 max.
420 typ.
700 max.
650 typ.
CT @ 0 V
(pF)
0.24 max.
0.18 typ.
0.24 max.
0.18 typ.
0.24 max.
0.18 typ.
R
T
Slope Resistance
(V
F
1 - V
F
2) / (10.5 mA - 9.5 mA)
( )
16 typ.
20 max.
12 typ.
18 max.
11 typ.
15 max.
MA4E2508L
MA4E2508M
MA4E2508H
Low
Medium
High
1. R
T
is the dynamic slope resistance where R
T
= R
S
+ R
J
, where R
J
= 26 / I
DC
(I
DC
is in mA) and R
S
is the ohmic resistance.
2. Maximum forward voltage difference DVf @ 1 mA: 10 mV
Spice Parameters (Per Diode)
3
Barrier
Low
Medium
High
I
S
(nA)
26
5.0 E-1
5.7 E-2
R
S
( )
12.8
9.6
6.5
N
1.20
1.20
1.20
C
J
0
(pF)
1.0 E-2
1.0 E-2
1.0 E-2
M
0.5
0.5
0.5
I
K
(mA)
14
10
4
C
J
par
(pF)
9.0 E-2
9.0 E-2
9.0 E-2
V
J
(V)
8.0 E-2
8.0 E-2
8.0 E-2
FC
0.5
0.5
0.5
BV
(V)
5.0
5.0
5.0
IBV
(mA)
1.0 E-2
1.0 E-2
1.0 E-2
3. Spice parameters (Per Diode) are based on the MA4E2502 Series datasheet.
Absolute Maximum Ratings @ +25°C
Parameter
Forward Current
Reverse Voltage
RF CW Incident Power
RF & DC Dissipated Power
Junction Temperature
Operating Temperature
Storage Temperature
Absolute Maximum
20 mA
5V
20 dBm
50 mW
+175°C
-40°C to +125°C
-40°C to +150°C
Handling Procedures
Please observe the following precautions to avoid
damage:
Static Sensitivity
These electronic devices are sensitive to electrostatic
discharge (ESD) and can be damaged by static
electricity. Proper ESD control techniques should be
used when handling these Class 0 devices.
4. Exceeding any one or combination of these limits may cause
permanent damage to this device.
5. MACOM does not recommend sustained operation near these
survivability limits.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MA4E2508 Series
SURMOUNT
TM
Low, Medium, & High Barrier Silicon
Schottky Diodes: Anti-Parallel Pair
Circuit Mounting Dimensions (Inches)
Rev. V5
0.020
0.020
0.020
0.020
0.013
Applications
The MA4E2508 family of surmount Schottky diodes
are recommended for use in microwave circuits
through Ku band frequencies for lower power
applications such as mixers, sub-harmonic mixers,
detectors and limiters. The HMIC construction
facilitates the direct replacement of more fragile
beam lead diodes with the corresponding surmount
diode, which can be connected to a hard or soft
substrate circuit with solder.
Die Bonding
Die attach for these devices is made simple through
the use of surface mount die attach technology.
Mounting pads are conveniently located on the
bottom surface of these devices, and are opposite
the active junction. The devices are well suited for
higher temperature solder attachment onto hard
substrates.
For hard substrates, we recommend utilizing a
vacuum tip and force of 60 to 100 grams applied
uniformly to the top surface of the device, using a
hot gas bonder with equal heat applied across the
bottom mounting pads of the device. When soldering
to soft substrates, it is recommended to use a
lead-tin interface at the circuit board mounting pads.
Position the die so that its mounting pads are
aligned with the circuit board mounting pads.
Reflow the solder paste by applying equal heat to
the circuit at both die-mounting pads. The solder
joint must not be made one at a time, creating
un-equal heat flow and thermal stress. Solder reflow
should not be performed by causing heat to flow
through the top surface of the die. Since the HMIC
glass is transparent, the edges of the mounting pads
can be visually inspected through the die after die
attach is completed.
Handling
All semiconductor chips should be handled with care
to avoid damage or contamination from perspiration
and skin oils. The use of plastic tipped tweezers or
vacuum pickups is strongly recommended for
individual components. The top surface of the die
has a protective polyimide coating to minimize the
damage.
The rugged construction of these surmount devices
allows the use of standard handling and die attach
techniques. It is important to note that industry
standard electrostatic discharge (ESD) control is
required at all times, due to the sensitive nature of
Schottky junctions. Bulk handling should insure that
abrasion and mechanical shock are minimized.
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MA4E2508 Series
SURMOUNT
TM
Low, Medium, & High Barrier Silicon
Schottky Diodes: Anti-Parallel Pair
MA4E2508 Schematic Per Diode
Rev. V5
Schematic Values per Diode
Model Number
MA4E2508L
MA4E2508M
MA4E2508H
L
S
(nH)
0.8
0.8
0.8
R
S
( )
12.8
9.6
6.5
R
J
( )
26 / Idc (mA)
26 / Idc (mA)
26 / Idc (mA)
C
T
(pF)
0.09
0.09
0.09
Ordering Information
Part Number
MA4E2508L-1112
MA4E2508M-1112
MA4E2508H-1112
MADS-002508-1112LP
MADS-002508-1112MP
MADS-002508-1112HP
3000 piece reel
100 die in carrier
Packaging
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MA4E2508 Series
SURMOUNT
TM
Low, Medium, & High Barrier Silicon
Schottky Diodes: Anti-Parallel Pair
Rev. V5
M/A-COM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
to any intellectual property rights is granted by this document.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR
INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY
OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN
THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM
customers using or selling MACOM products for use in such applications do so at their own risk and agree to
fully indemnify MACOM for any damages resulting from such improper use or sale.
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
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