isolation, low insertion loss, and high linearity at
2.4 - 2.5 GHz. This device is fabricated using a
0.5 micron gate length GaAs pHEMT process.
The process features full passivation for
performance and reliability. This die features
SnAg(3.5%)Cu(1%) solder bumps for Wafer Level
Chip Scale Package (WLCSP) applications.
Die Bump Pad Configuration
Name
V
C
1
BT
GND
R
X
Description
Voltage Control 1
Blue Tooth T
X
/R
X
Port
Ground
2.5 GHz R
X
Port
Voltage Control 3
2.5 GHz T
X
Port
Voltage Control 2
Antenna Port
Ordering Information
Part Number
MASW-009276-001D3K
MASW-009276-002SMB
Package
Die in 3000 piece reel
Sample Board SP3T
V
C
3
T
X
V
C
2
RFC
Absolute Maximum Ratings
1,2
Parameter
Input Power @ 3 V Control
Input Power @ 5 V Control
Operating Voltage
Operating Temperature
Storage Temperature
Absolute Maximum
+32 dBm
+35 dBm
+8 volts
-40°C to +85°C
-65°C to +150°C
1. Exceeding any one or combination of these limits may cause
permanent damage to this device.
2. M/A-COM Technology does not recommend sustained
operation near these survivability limits.
1
*
Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW-009276-001DIE
Bumped GaAs SP3T Switch for WLAN
1.0 - 4.0 GHz
Electrical Specifications
3
: T
A
= 25°C, Z
0
= 50 Ω, Vc = 0 V / 3 V, Pin = 0 dBm
Parameter
Insertion Loss
Isolation
Return Loss
IP3
Input P1dB
Harmonics
Switching Speed
Control Current
3. External blocking capacitors on all RF ports.
Rev. V2
Test Conditions
RFC to Tx/Rx/BT, 2.4 GHz
RFC to Tx, 2.4 GHz
RFC to Rx, 2.4 GHz
RFC to BT, 2.4 GHz
2.4 - 2.5 GHz
RFC to Tx/Rx/BT, 2.4 GHz, 20 dBm Total Power, 1MHz Spacing
RFC to Tx, 2.4 GHz
RFC to Rx, 2.4 GHz
RFC to BT, 2.4 GHz
RFC to Tx 2.4 GHz, 20 dBm
50% control to 90% RF
50%control to 10% RF
|Vc| = 3 V
Units
dB
dB
dB
dB
dB
dBm
dBm
dBm
ns
µA
Min.
—
20
30
20
—
—
—
—
—
—
—
—
—
Typ.
0.5
24
32
24
15
55
32
28
32
-75
165
25
<1
Max.
0.75
—
—
—
—
—
—
—
—
—
—
—
10
Recommended PCB Configuration
Truth Table
4,5,6
V
C
1
1
0
0
V
C
2
0
1
0
V
C
3
0
0
1
RFC–BT
On
Off
Off
RFC-T
X
RFC-R
X
Off
On
Off
Off
Off
On
4. For positive voltage control, external DC blocking capacitors
are required on all RF ports.
5. Differential voltage, V(state 1) - V(state 0), must be
+2.7 V minimum and must not exceed +5 V.
6. 0 = 0 ± 0.3 V, 1 = +2.7 V to +5 V.
Handling Procedures
Parts List
Part
C1 - C4
C5 - C7
Value
39 pF
1000 pF
Case Style
0402
0402
Please observe the following precautions to avoid
damage:
Static Sensitivity
Gallium Arsenide Integrated Circuits are sensitive
to electrostatic discharge (ESD) and can be
damaged by static electricity. Proper ESD control
techniques should be used when handling these
devices.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW-009276-001DIE
Bumped GaAs SP3T Switch for WLAN
1.0 - 4.0 GHz
Product Consistency Distribution Charts
7
(on wafer RF test)
LS L
Rev. V2
Process Capability
P rocess D ata
LS L
20
Target
*
S ample M ean 24.1799
O v erall C apability
P pk
8.55
LS L
Process Capability
P rocess D ata
LS L
30
Target
*
S ample M ean 32.0545
O v erall C apability
P pk
3.04
18
19
20
21
22
23
24
25
26
27
28
28
29
30
31
32
33
34
35
36
37
38
Tx
BT
BT Isolation
T
X
and
and
Isolation (dB)
(dB)
R
RX Isolation (dB)
X
Isolation (dB)
LB
Process Capability
P rocess D ata
LB
0
Target
*
USL
0.75
S ample M ean 0.513984
O v erall C apability
P pk
2.64
USL
LB
Process Capability
P rocess D ata
LB
0
Target
*
USL
2
S ample M ean 0.272007
USL
O v erall C apability
P pk
3.69
-0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.00
0.28
0.56
0.84
1.12
1.40
1.68
1.96
Insertion
- All
(dB)
Insertion Loss
Loss
Paths (dB)
Switch
Current -
-
All Paths (µA)
Current All Paths (uA)
7. Represents >5 wafers, tested per electrical specifications, probed directly on the die to the solder bump: T
A
= 25°C, Z
0
= 50
Ω,
V
C
= 0/3V,
P
IN
= 0 dBm
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW-009276-001DIE
Bumped GaAs SP3T Switch for WLAN
1.0 - 4.0 GHz
Typical Performance Curves (plots = chip on board assembly)
T
X
Insertion Loss
0.80
+25°C
-40°C
+85°C
Rev. V2
T
X
Isolation
35
0.75
30
+25°C
-40°C
+85°C
0.70
25
0.65
20
0.60
2.40
2.42
2.44
2.46
2.48
2.50
15
2.40
2.42
2.44
2.46
2.48
2.50
Frequency (GHz)
Frequency (GHz)
R
X
Insertion Loss
0.75
R
X
Isolation
35
0.70
30
0.65
25
+25°C
-40°C
+85°C
0.60
+25°C
-40°C
+85°C
20
0.55
2.40
2.42
2.44
2.46
2.48
2.50
15
2.40
2.42
2.44
2.46
2.48
2.50
Frequency (GHz)
Frequency (GHz)
BT Insertion Loss
0.80
+25°C
-40°C
+85°C
BT Isolation
35
0.75
30
+25°C
-40°C
+85°C
0.70
25
0.65
20
0.60
2.40
2.42
2.44
2.46
2.48
2.50
15
2.40
2.42
2.44
2.46
2.48
2.50
Frequency (GHz)
Frequency (GHz)
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW-009276-001DIE
Bumped GaAs SP3T Switch for WLAN
1.0 - 4.0 GHz
Die Dimensions (Top and Side Views)
PCB Top Metal / Solder Mask
Rev. V2
Die Bump Pad Layout - Top View
(bump side up)
Die Bump Pad Layout - Bottom View
(bump side down - as installed on board)
8. Orientation mark is only on material that is shipped in tape and
reel. The mark is not available on die shipped on grip ring.
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
据外媒报道，萨里大学（University of Surrey）的研究人员开发出一种无需依赖GPS即可在人口密集的城市地区精确定位设备位置的人工智能系统。该系统可将定位误差从734米缩小到22米以内，这对于自动驾驶汽车和救援车辆等技术的发展意义重大。 图片来源： 萨里大学 在发表于《IEEE Robotics and Automation Letters》的论文中，研究人员介绍了PEn...[详细]
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