BCM
®
in a VIA™ Package
Bus Converter
BCM4414xD1E5135yzz
®
S
C
US
C
NRTL
US
Isolated Fixed-Ratio DC-DC Converter
Features & Benefits
•
Up to 35A continuous low-voltage-side current
•
Fixed transformation ratio (K) of 1/8
•
Up to 797W/in
3
power density
•
97.7% peak efficiency
•
Built-in EMI filtering and inrush limiting circuit
•
Parallel operation for multi-kW arrays
•
OV, OC, UV, short circuit and thermal protection
•
4414 package
•
High MTBF
•
Thermally-enhanced VIA package
•
PMBus™ management interface
•
Suitable for Hot-Swap applications
Product Ratings
V
HI
= 400V (260 – 410V)
V
LO
= 50V (32.5 – 51.3V)
(
no load
)
I
LO
= up to 35A
K = 1/8
Product Description
The
BCM4414xD1E5135yzz
in a VIA package is a high-efficiency
Bus Converter, operating from a 260 to 410V
DC
high-voltage bus to
deliver an isolated 32.5 to 51.3V
DC
unregulated, low voltage.
This unique ultra-low-profile module incorporates DC-DC
conversion, integrated filtering and PMBus™ commands and
controls in a chassis- or PCB-mount form factor.
The BCM offers low noise, fast transient response and
industry-leading efficiency and power density. A low-voltage-side
referenced PMBus-compatible telemetry and control interface
provides access to the BCM’s configuration, fault monitoring and
other telemetry functions.
Leveraging the thermal and density benefits of Vicor VIA packaging
technology, the BCM module offers flexible thermal management
options with very low top- and bottom-side thermal impedances.
When combined with downstream Vicor DC-DC conversion
components and regulators, the BCM allows the Power Design
Engineer to employ a simple, low-profile design, which will
differentiate the end system without compromising on cost or
performance metrics.
Typical Applications
•
380V
DC
Power Distribution
•
Information and Communication
Technology (ICT) Equipment
•
High-End Computing Systems
•
Automated Test Equipment
•
Industrial Systems
•
High-Density Energy Systems
•
Transportation
•
Green Buildings and Microgrids
Size:
4.35 x 1.40 x 0.37 in
[110.55 x 35.54 x 9.40mm]
Part Ordering Information
Product
Function
BCM
BCM =
Bus Converter
Module
[a]
Package
Length
44
Length in
Inches x 10
Package
Width
14
Width in
Inches x 10
Package
Type
x
B
= Board VIA
V
= Chassis VIA
High‑Side
Max
Max
Max
Voltage
Product Grade
High‑Side
Low‑Side Low‑Side
Range
(Case Temperature)
Voltage
Voltage Current
Ratio
D1
E
51
35
y
C
= –20 to 100°C
[a]
T
= –40 to 100°C
[a]
Option Field
zz
02
= Chassis/PMBus
06
= Short Pin/PMBus
10
= Long Pin/PMBus
Internal Reference
High-temperature current derating may apply; See Figure 1, specified thermal operating area.
BCM
®
in a VIA™ Package
Page 1 of 43
Rev 1.8
08/2018
BCM4414xD1E5135yzz
Typical Applications (Cont.)
Host PMBus™
PMBus
V
EXT
+
–
SGND
SGND
BCM in a VIA Package
EXT_BIAS
SCL
SDA
SGND
ADDR
FUSE
V
HI
SGND
PRM
ENABLE
TRIM
AL
VAUX
REF/
REF_EN
VT
VC
IFB
R
PRM_SGND
enable/disable
switch
}
VTM
Adaptive Loop Temperature Feedback
VTM Start Up Pulse
V
TM
VC
PC
O_PRM_DAMP
+OUT
OUT
3
PRM_SGND
SGND
R
TRIM_PRM
R
SHARE/
CONTROL NODE
AL_PRM
R
I_PRM_DAMP
C
+IN
O_VTM_CER
LOAD
+HI
C
HI
+LO
L
+IN
R
I_PRM_CER
+OUT
I_PRM_FLT
L
O_PRM_FLT
C
O_PRM_CER
–HI
SOURCE_RTN
HV
LV
ISOLATION BOUNDARY
–LO
–IN
SGND
–OUT
–IN
HV
LV
ISOLATION BOUNDARY
–OUT
LOAD_RTN
PRM_SGND
BCM4414xD1E5135yzz + PRM™ + VTM™, Adaptive-Loop Configuration – connection to Host PMBus
Host PMBus™
PMBus
V
EXT
+
–
SGND
SGND
SGND
V
REF
BCM in a VIA Package
EXT_BIAS
SCL
SDA
SGND
ADDR
FUSE
V
HI
enable/disable
switch
3
PRM_SGND
}
ENABLE
TRIM
VAUX
GND
Voltage Sense and Error Amplifier
(Differential)
REF/
REF_EN
VT
VC
IFB
V+
VOUT
+IN
–IN
SGND
V–
VTM
TM
VC
PC
R
O_PRM_DAMP
L
O_PRM_FLT
+IN
C
C
+OUT
VTM Start up Pulse
AL
SHARE/
CONTROL NODE
PRM_SGND
Voltage Reference with Soft Start
SGND
PRM_SGND
R
I_PRM_DAMP
L
+IN
O_VTM_CER
LOAD
+HI
C
HI
+LO
–LO
HV
LV
ISOLATION BOUNDARY
+OUT
External Current Sense
I_PRM_FLT
C
I_PRM_ELEC
–IN
O_PRM_CER
–IN
HV
ISOLATION BOUNDARY
–HI
SOURCE_RTN
SGND
–OUT
–OUT
LV
PRM_SGND
0
BCM4414xD1E5135yzz + PRM + VTM, Remote-Sense Configuration – connection to Host PMBus
BCM
®
in a VIA™ Package
Page 3 of 43
Rev 1.8
08/2018
Voltage Sense
PRM
REF 3312
IN
OUT
PRM_SGND
PRM_SGND
BCM4414xD1E5135yzz
Pin Configuration
1
+HI
TOP VIEW
3
+LO
5
6
7
8
9
–LO
2
4
EXT BIAS
SCL
SDA
SGND
ADDR
PMBus™
–HI
BCM4414 in a VIA Package - Chassis (Lug) Mount
TOP VIEW
4
–LO
9
8
7
6
5
+LO
ADDR
SGND
SDA
SCL
EXT BIAS
2
–HI
PMBus™
+HI
1
3
BCM4414 in a VIA Package - Board (PCB) Mount
Note:
The dot on the VIA housing indicates the location of the signal pin 9.
Pin Descriptions
Pin Number
1
2
3
4
5
6
7
8
9
Signal Name
+HI
–HI
+LO
–LO
EXT BIAS
SCL
SDA
SGND
ADDR
Type
HIGH SIDE POWER
HIGH SIDE POWER
RETURN
LOW SIDE
POWER
LOW SIDE
POWER RETURN
INPUT
INPUT
INPUT/OUTPUT
LOW SIDE
SIGNAL RETURN
INPUT
Function
High-voltage-side positive power terminal
High-voltage-side negative power terminal
Low-voltage-side positive power terminal
Low-voltage-side negative power terminal
5V supply input
I
2
C™ Clock, PMBus™ Compatible
I
2
C Data, PMBus™ Compatible
Signal Ground
Address assignment - Resistor based
Notes:
All signal pins (5, 6, 7, 8, 9) are referenced to the low-voltage side and isolated from the high-voltage side.
Keep SGND signal separated from the low-voltage side power return terminal (–LO) in electrical design.
BCM
®
in a VIA™ Package
Page 4 of 43
Rev 1.8
08/2018
BCM4414xD1E5135yzz
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device.
Parameter
+HI to –HI
HI_DC or LO_DC Slew Rate
+LO to –LO
EXT BIAS to SGND
SCL to SGND
SDA to SGND
ADDR to SGND
Basic insulation (high-voltage side to case)
Isolation Voltage /
Dielectric Withstand
[b]
Comments
Min
–1
Max
480
N/A
Unit
V
V/µs
V
V
A
V
V
V
V
DC
V
DC
V
DC
Internal hot-swap circuitry
–1
–0.3
60
10
0.15
–0.3
–0.3
–0.3
2121
2121
707
5.5
5.5
3.6
Basic insulation (high-voltage side to low-voltage side)
[b]
Functional insulation (low-voltage side to case)
The absolute maximum rating listed above for dielectric withstand (high-voltage side to low-voltage side) refers to the VIA package. The internal safety
approved isolating component (ChiP) provides reinforced insulation (4242V) from high-voltage side to low-voltage side. However, the VIA package itself can
only be tested at a basic insulation value (2121V).
BCM
®
in a VIA™ Package
Page 5 of 43
Rev 1.8
08/2018
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