NJL6163R-1
HIGH SPEED PIN PHOTO DIODE
GENERAL DESCRIPTION
The NJL6163R-1 are the PIN photo diode,
which attain high speed (fc : 200MHz) and
It shrinks the outline by COBP(Chip on Board
Package), and attain under half package
volume compared with lead frame type.
Active area
1.8
0.3
3.6
OUTLINE (typ.)
Unit : mm
NJL6163R
1.8
Active area: 1.0 mm square
1.16
0.5
1.0
0.3
0.3
(2x)R0.3
high sensitivity (S : 0.65A/W).
•
High speed, high sensitivity
•
Miniature, thin type
NJL6163R-1 (1.8mmX3.6mmX1.16mm)
anode
cathode
1.0
APPLICATIONS
•
Laser monitor for CD-R/RW, DVD+/-R/RW/-RAM, recordable MD
etc.
•
Reading the signal for optical communication
etc.
ABSOLUTE MAXIMUM RATINGS
(Ta=25°C)
PARAMETER
Reverse Voltage
Operating Temperature
Storage Temperature
Reflow Soldering Temperature
SYMBOL
V
R
T
opr
T
stg
T
sol
RATINGS
35
-30 to +85
-40 to +100
260
UNIT
V
°C
°C
°C
ELECTRO-OPTICAL CHARACTERISTICS
(Ta=25°C)
PARAMETER
Dark Current
Forward Voltage
Capacitance
Peak Wavelength
Sensitivity
Cut off Frequency
SYMBOL
I
D
V
F
C
t
λ
P
S
fc
TEST CONDITION
V
R
=10V
I
F
=1mA
V
R
=2.0V, f=1MHz
MIN
—
V
R
=2.0V,
λ=780nm
(note)
V
R
=2.0V,
λ=780nm,
RL=50Ω, -3dB
—
—
—
—
0.50
—
TYP
0.1
—
10
800
0.65
200
MAX
2.0
1.0
—
—
—
—
UNIT
nA
V
pF
nm
A/W
MHz
(note) in the case of illuminating all over the package
0.95
FEATURES
0.95
-1-
NJL6163R-1
TYPICAL CHARACTERISTICS
Relative Sensitivity vs. Illuminance (Ta=25°C)
1.00E-02
Spectral Response (Ta=25°C)
100
90
1.00E-03
VR=2V,
λ=780nm
80
70
Relative Sensitivity (%)
1.00E-04
Light Current IL(A)
60
50
40
30
20
1.00E-05
1.00E-06
1.00E-07
10
1.00E-08
0.01
0.1
1
Illuminance
(mW/cm )
2
10
100
0
500
600
700
800
900
1000
1100
Wavelength
λ
(nm)
1.00E-08
Dark Current vs. Temperature
105%
104%
Relative Sensitivity vs. Temperature
VR=2V,
λ=780nm
VR=2V,
λ
=780nm
1.00E-09
103%
102%
Dark Current ID(A)
1.00E-10
Relative Sens itivity (%)
-40
-20
0
20
40
60
80
100
101%
100%
99%
98%
1.00E-11
1.00E-12
97%
96%
1.00E-13
Ambient Temperature Ta(
℃
)
95%
-40
-20
0
20
40
60
80
100
Ambient Temperature Ta(
℃
)
Rise Time vs. Reverse Voltage (Ta=25°C)
20
Fall Time vs. Reverse Voltage (Ta=25°C)
20
λ=780nm,
RL=50Ω
λ=780nm,
RL=50Ω
15
15
Rise Tim e tr (ns)
10
Fall Time tr (ns )
0
1
2
3
4
5
10
5
5
0
0
Reverse Voltage
VR(V)
0
1
2
3
4
5
Revers e Voltage
VR(V)
-2-
NJL6163R-1
Relative Sensitivity vs. Frequency (Ta=25°C)
0
Capacitance vs. Reverse Voltage (Ta=25°C)
15
-1
14
13
-2
Relative Sensitivity (dB)
Capasitance Cj (pF)
VR=2V,
λ=780nm,
RL=50Ω
12
-3
11
-4
10
-5
9
-6
8
1
10
100
1000
0
1
2
3
4
5
Frequency f(MHz)
Reverse Voltage VR(V)
MEASURING CIRCUIT FOR RESPONSE TIME
Oscilloscope
Pulse
Generator
Input
50Ω
NJL6163R-1
Output
tr
tf
90%
10%
Laser
-3-
NJL6163R-1
PRECAUTION FOR HANDLING
1. Soldering to actual circuit board
Soldering condition
- Heated condition of plastic package.
Lower than 260
°C
of maximum surface temperature
Soldering Method
1) Reflow Method
Recommended temperature profile of its method.
Soldering to be done within twice under this condition.
a : Temperature ramping rate
b : Pre-heating temperature
time
c : Temperature ramping rate
d : 220°C or higher time
e : 230°C or higher time
f : Peak temperature
g : Temperature ramping rate
: 1 to 4°C/s
: 150 to 180°C
: 60 to 120s
: 1 to 4°C /s
: Shorter than 60s
: Shorter than 40s
: Lower than 260°C
: 1 to 6°C /s
f
260°C
230°C
220°C
180°C
150°C
e
d
The temperature indicates at the surface of mold
package
Room
Temp.
a
b
c
g
2) Reflow Method
(In
case of infrared heating)
- Temperature profile : Same to the above
- Avoid direct irradiation to the plastic package because it is mold resin, absorbs the Infrared Radiation and its surface
temperature will be higher than lead itself.
3) The other method
Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method
(
VPS).
If the device is heated to high temperature and kept in its condition for longer time, it would affect to its reliability.
It is necessary to solder in short time as soon as possible.
2. Cleaning
Avoid washing of the device after soldering by reflow method.
3. Attention in handling
1) Treat not to touch the lens surface.
2) Avoid dust and any other foreign materials (paint, bonding material, etc.) on the lens surface.
4. Storage
In order to prevent from degradation of this device in moisturing at reflow method, so that this device is contained in
deaeration packaging. So that mount the device as short as possible after opening the envelope.
-4-
NJL6163R-1
NJL6163R-1 Taping Specification
1. Taping Size
1) Carrier tape is used with Styrene type Carbonated Plastic.
2) Cover tape is used with electro statistically prevention treated Polyester type tape.
3) Product taping direction is to place the index mark against the pull out direction of the tape as in the drawing.
NJL6163R-1
Pull out direction of tape
4.0
Unit:mm
φ
1.5
1.75
2.0
0.3
5.5
4.2
2.4
4.0
1.5
Carrier tape
12.0
Cover tape
2. Taping Strength
Pull up the cover tape from the carrier tape, and when the opening angle comes around 10 to 15°, and the peeling-off
strength is to be within the power of 20 to 70g.
3. Packaging
1) The taped products are to be rolled up on the taping reel as on the drawing.
2) Rolling up specification
2-1) Start Rolling : Carrier tape open space more than
20 Pieces.
2-2) End of Rolling : Carrier tape open space more than
20 Pieces, and 2 round of reel space at the cover tape only.
3) Taping quantity : 2,000 Pieces
4) Seal off after putting each reels in a dampproof bag with
silica gel (3 bags).
φ
13
13
Unit:mm
Label
-5-
φ
180
φ
60
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
