Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop 8-DSBGA -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | VFBGA, BGA8,2X4,16 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| Samacsys Descripti | Low-Power Single Positive-Edge-Triggered D-Type Flip-Fl |
| 系列 | AUP/ULP/V |
| JESD-30 代码 | R-XBGA-B8 |
| JESD-609代码 | e1 |
| 负载电容（CL） | 30 pF |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 最大频率@ Nom-Su | 40000000 Hz |
| 最大I（ol） | 0.004 A |
| 湿度敏感等级 | 1 |
| 位数 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA8,2X4,16 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 包装方法 | TR |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.2/3.3 V |
| 最大电源电流（ICC） | 0.0009 mA |
| Prop。Delay @ Nom-Su | 27 ns |
| 传播延迟（tpd） | 27 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.5 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 0.8 V |
| 标称供电电压 (Vsup) | 1.2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.4 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE |
| 最小 fmax | 180 MHz |
| SN74AUP1G74YFPR | SN74AUP1G74DCURG4 | SN74AUP1G74DQER | SN74AUP1G74RSER | SN74AUP1G74YZPR | |
|---|---|---|---|---|---|
| 描述 | Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop 8-DSBGA -40 to 85 | Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop 8-VSSOP -40 to 85 | Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop 8-X2SON -40 to 85 | Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop 8-UQFN -40 to 85 | Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop 8-DSBGA -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | BGA | SOIC | SON | QFN | BGA |
| 包装说明 | VFBGA, BGA8,2X4,16 | VSSOP, TSSOP8,.12,20 | VSON, SOLCC8,.04,14 | VQCCN, LCC8,.06SQ,20 | VFBGA, BGA8,2X4,20 |
| 针数 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compli | compli | compli | compli |
| 系列 | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V |
| JESD-30 代码 | R-XBGA-B8 | R-PDSO-G8 | R-PDSO-N8 | S-PQCC-N8 | R-XBGA-B8 |
| JESD-609代码 | e1 | e4 | e4 | e4 | e1 |
| 负载电容（CL） | 30 pF | 30 pF | 30 pF | 30 pF | 30 pF |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 最大频率@ Nom-Su | 40000000 Hz | 40000000 Hz | 40000000 Hz | 40000000 Hz | 40000000 Hz |
| 最大I（ol） | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | VFBGA | VSSOP | VSON | VQCCN | VFBGA |
| 封装等效代码 | BGA8,2X4,16 | TSSOP8,.12,20 | SOLCC8,.04,14 | LCC8,.06SQ,20 | BGA8,2X4,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 包装方法 | TR | TR | TR | TR | TR |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 |
| 电源 | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V |
| 最大电源电流（ICC） | 0.0009 mA | 0.0009 mA | 0.0009 mA | 0.0009 mA | 0.0009 mA |
| Prop。Delay @ Nom-Su | 27 ns | 27 ns | 27 ns | 27 ns | 27 ns |
| 传播延迟（tpd） | 27 ns | 27 ns | 27 ns | 27 ns | 27 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.5 mm | 0.9 mm | 0.4 mm | 0.6 mm | 0.5 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V |
| 标称供电电压 (Vsup) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | GULL WING | NO LEAD | NO LEAD | BALL |
| 端子节距 | 0.4 mm | 0.5 mm | 0.35 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | DUAL | DUAL | QUAD | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 最小 fmax | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 180 MHz |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 1 week | 6 weeks | - | 6 weeks | 6 weeks |
| 长度 | - | 2.3 mm | 1.4 mm | 1.5 mm | 1.9 mm |
| 宽度 | - | 2 mm | 1 mm | 1.5 mm | 0.9 mm |
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