Single 2-Line to 1-Line Data Selector/Multiplexer 8-DSBGA -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | BGA |
| 包装说明 | VFBGA, BGA8,2X4,20 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 系列 | LV/LV-A/LVX/H |
| JESD-30 代码 | R-XBGA-B8 |
| JESD-609代码 | e1 |
| 长度 | 1.9 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER |
| 最大I（ol） | 0.032 A |
| 湿度敏感等级 | 1 |
| 位数 | 2 |
| 功能数量 | 1 |
| 输入次数 | 2 |
| 输出次数 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA8,2X4,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 包装方法 | TR |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| 最大电源电流（ICC） | 0.01 mA |
| Prop。Delay @ Nom-Su | 6 ns |
| 传播延迟（tpd） | 14 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.5 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 0.9 mm |
| Base Number Matches | 1 |
| SN74LVC2G157YZPR | 74LVC2G157DCTRE4 | 74LVC2G157DCURE4 | 74LVC2G157DCURG4 | 74LVC2G157DCUTE4 | 74LVC2G157DCUTG4 | SN74LVC2G157DCTRG4 | SN74LVC2G157DCUT | SN74LVC2G157YEPR | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Single 2-Line to 1-Line Data Selector/Multiplexer 8-DSBGA -40 to 85 | Single 2-Line to 1-Line Data Selector/Multiplexer 8-SM8 -40 to 85 | Encoders, Decoders, Multiplexers & Demultiplexers Sgle2-1 Line Data Sel/Multipl | Single 2-Line to 1-Line Data Selector/Multiplexer 8-VSSOP -40 to 85 | Encoders, Decoders, Multiplexers & Demultiplexers Sgle2-1 Line Data Sel/Multipl | Single 2-Line to 1-Line Data Selector/Multiplexer 8-VSSOP -40 to 85 | Single 2-Line to 1-Line Data Selector/Multiplexer 8-SM8 -40 to 85 | Single 2-Line to 1-Line Data Selector/Multiplexer 8-VSSOP -40 to 85 | IC SNGL 2TO1 DATA SELCT 8-DSBGA |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 不符合 |
| 零件包装代码 | BGA | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | BGA |
| 包装说明 | VFBGA, BGA8,2X4,20 | LSSOP, SSOP8,.16 | VSSOP, TSSOP8,.12,20 | VSSOP, TSSOP8,.12,20 | VSSOP, TSSOP8,.12,20 | VSSOP, TSSOP8,.12,20 | LSSOP, SSOP8,.16 | VSSOP, TSSOP8,.12,20 | VFBGA, BGA8,2X4,20 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compli | not_compliant |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - |
| 是否无铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | - |
| Factory Lead Time | 1 week | 6 weeks | - | 6 weeks | - | 6 weeks | - | 1 week | 1 week |
| 系列 | LV/LV-A/LVX/H | - | LV/LV-A/LVX/H | LV/LV-A/LVX/H | - | LVC/LCX/Z | LV/LV-A/LVX/H | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-XBGA-B8 | - | R-PDSO-G8 | R-PDSO-G8 | - | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PBGA-B8 |
| JESD-609代码 | e1 | - | e4 | e4 | - | e4 | e4 | e4 | e0 |
| 长度 | 1.9 mm | - | 2.3 mm | 2.3 mm | - | 2.3 mm | 2.95 mm | 2.3 mm | 1.9 mm |
| 负载电容（CL） | 50 pF | - | 50 pF | 50 pF | - | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER | - | MULTIPLEXER | MULTIPLEXER | - | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 最大I（ol） | 0.032 A | - | 0.024 A | 0.032 A | - | 0.032 A | 0.032 A | 0.032 A | 0.024 A |
| 湿度敏感等级 | 1 | - | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 位数 | 2 | - | - | 2 | - | 2 | 2 | 2 | - |
| 功能数量 | 1 | - | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 输入次数 | 2 | - | 2 | 2 | - | 2 | 2 | 2 | 2 |
| 输出次数 | 1 | - | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | - | 8 | 8 | - | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | - | 3-STATE | 3-STATE | - | 3-STATE | - | 3-STATE | 3-STATE |
| 输出极性 | COMPLEMENTARY | - | COMPLEMENTARY | COMPLEMENTARY | - | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | UNSPECIFIED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | - | VSSOP | VSSOP | - | VSSOP | LSSOP | VSSOP | VFBGA |
| 封装等效代码 | BGA8,2X4,20 | - | TSSOP8,.12,20 | TSSOP8,.12,20 | - | TSSOP8,.12,20 | SSOP8,.16 | TSSOP8,.12,20 | BGA8,2X4,20 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 包装方法 | TR | - | TAPE AND REEL | TR | - | TR | TR | TR | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 | - | 260 | 260 | - | 260 | 260 | 260 | NOT SPECIFIED |
| 电源 | 3.3 V | - | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 最大电源电流（ICC） | 0.01 mA | - | - | 0.01 mA | - | 0.01 mA | 0.01 mA | 0.01 mA | - |
| Prop。Delay @ Nom-Su | 6 ns | - | 6 ns | 6 ns | - | 6 ns | 6 ns | 6 ns | - |
| 传播延迟（tpd） | 14 ns | - | 14 ns | 14 ns | - | 14 ns | 14 ns | 14 ns | 14 ns |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.5 mm | - | 0.9 mm | 0.9 mm | - | 0.9 mm | 1.3 mm | 0.9 mm | 0.5 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V | - | 1.65 V | 1.65 V | - | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V | - | 1.8 V | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | - | YES | YES | - | YES | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL | - | GULL WING | GULL WING | - | GULL WING | GULL WING | GULL WING | BALL |
| 端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm | - | 0.5 mm | 0.65 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | - | DUAL | DUAL | - | DUAL | DUAL | DUAL | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 0.9 mm | - | 2 mm | 2 mm | - | 2 mm | 2.8 mm | 2 mm | 0.9 mm |
| Base Number Matches | 1 | - | - | 1 | - | 1 | 1 | 1 | 1 |
FPGA/CPLD
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模拟电子
模拟与混合信号
Microchip MCU
stm32/stm8
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