Dual Inverter Buffer/Driver with Open-Drain Output 6-DSBGA -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | VFBGA, BGA6,2X3,20 |
| 针数 | 6 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-XBGA-B6 |
| JESD-609代码 | e1 |
| 长度 | 1.4 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | INVERTER |
| 最大I（ol） | 0.032 A |
| 湿度敏感等级 | 1 |
| 功能数量 | 2 |
| 输入次数 | 1 |
| 端子数量 | 6 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | OPEN-DRAIN |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA6,2X3,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 包装方法 | TR |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| 最大电源电流（ICC） | 0.01 mA |
| Prop。Delay @ Nom-Su | 3.4 ns |
| 传播延迟（tpd） | 7.2 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 座面最大高度 | 0.5 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 0.9 mm |
| Base Number Matches | 1 |
| SN74LVC2G06YZPR | SN74LVC2G06DBVRE4 | SN74LVC2G06DBVRG4 | SN74LVC2G06DCKRE4 | SN74LVC2G06DCKRG4 | SN74LVC2G06DRYR | SN74LVC2G06DSFR | |
|---|---|---|---|---|---|---|---|
| 描述 | Dual Inverter Buffer/Driver with Open-Drain Output 6-DSBGA -40 to 85 | Dual Inverter Buffer/Driver with Open-Drain Output 6-SOT-23 -40 to 125 | Dual Inverter Buffer/Driver with Open-Drain Output 6-SOT-23 -40 to 125 | Dual Inverter Buffer/Driver with Open-Drain Output 6-SC70 -40 to 125 | Buffer/Driver 2-CH Inverting Open Drain CMOS 6-Pin SC-70 T/R | Dual Inverter Buffer/Driver with Open-Drain Output 6-SON -40 to 125 | Dual Inverter Buffer/Driver with Open-Drain Output 6-SON -40 to 125 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | - | 不含铅 | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | - | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA | SOT-23 | SOT-23 | SOIC | - | SON | SON |
| 包装说明 | VFBGA, BGA6,2X3,20 | SOT-23, 6 PIN | LSSOP, TSOP6,.11,37 | TSSOP, TSSOP6,.08 | - | VSON, SOLCC6,.04,20 | VSON, SOLCC6,.04,14 |
| 针数 | 6 | 6 | 6 | 6 | - | 6 | 6 |
| Reach Compliance Code | compli | compli | compli | compli | - | compli | compli |
| Factory Lead Time | 1 week | 6 weeks | - | 6 weeks | - | 6 weeks | 6 weeks |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | - | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-XBGA-B6 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-G6 | - | R-PDSO-N6 | S-PDSO-N6 |
| JESD-609代码 | e1 | e4 | e4 | e4 | - | e4 | e4 |
| 长度 | 1.4 mm | 2.9 mm | 2.9 mm | 2 mm | - | 1.45 mm | 1 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | - | 50 pF | 50 pF |
| 逻辑集成电路类型 | INVERTER | INVERTER | INVERTER | INVERTER | - | INVERTER | INVERTER |
| 最大I（ol） | 0.032 A | 0.032 A | 0.024 A | 0.032 A | - | 0.032 A | 0.032 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 功能数量 | 2 | 2 | 2 | 2 | - | 2 | 2 |
| 输入次数 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 端子数量 | 6 | 6 | 6 | 6 | - | 6 | 6 |
| 最高工作温度 | 85 °C | 125 °C | 125 °C | 125 °C | - | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 输出特性 | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | - | OPEN-DRAIN | OPEN-DRAIN |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | LSSOP | LSSOP | TSSOP | - | VSON | VSON |
| 封装等效代码 | BGA6,2X3,20 | TSOP6,.11,37 | TSOP6,.11,37 | TSSOP6,.08 | - | SOLCC6,.04,20 | SOLCC6,.04,14 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | SQUARE |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE |
| 包装方法 | TR | TR | TR | TR | - | TR | TR |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | - | 260 | 260 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V |
| 最大电源电流（ICC） | 0.01 mA | 0.01 mA | - | 0.01 mA | - | 0.01 mA | 0.01 mA |
| Prop。Delay @ Nom-Su | 3.4 ns | 3.9 ns | - | 3.9 ns | - | 3.9 ns | 3.9 ns |
| 传播延迟（tpd） | 7.2 ns | 7.2 ns | 7.2 ns | 7.2 ns | - | 7.2 ns | 7.2 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 施密特触发器 | NO | NO | NO | NO | - | NO | NO |
| 座面最大高度 | 0.5 mm | 1.45 mm | 1.45 mm | 1.1 mm | - | 0.6 mm | 0.4 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | - | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | - | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | BALL | GULL WING | GULL WING | GULL WING | - | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.95 mm | 0.95 mm | 0.65 mm | - | 0.5 mm | 0.35 mm |
| 端子位置 | BOTTOM | DUAL | DUAL | DUAL | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 0.9 mm | 1.6 mm | 1.6 mm | 1.25 mm | - | 1 mm | 1 mm |
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