PROTECTION PRODUCTS - µClamp
®
Description
µClamp
®
TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to ESD. They
are designed to replace 0201 size multilayer varistors
(MLVs) in portable applications such as cell phones,
notebook computers, and other portable electronics.
They feature large cross-sectional area junctions for con-
ducting high transient currents. This device offers desir-
able characteristics for board level protection including
fast response time, low operating and clamping voltage,
and no device degradation.
µClamp
®
3321ZA features extremely good ESD protec-
tion characteristics highlighted by low typical dynamic
resistance of 0.33 Ohms, low peak ESD clamping volt-
age, and high ESD withstand voltage (+/-15kV contact
per IEC 61000-4-2). Low maximum capacitance (5pF at
VR=0V) minimizes loading on sensitive cirucuits. Each
device will protect one data line operating at 3.3 Volts.
µClamp3321ZA is in a 2-pin SLP0603P2X3F package.
It measures 0.6 x 0.3 mm with a nominal height of only
0.25mm. Leads are finished with NiAu. The small pack-
age gives the designer the flexibility to protect single
lines in applications where arrays are not practical. The
combination of small size and high ESD surge capability
makes them ideal for use in portable applications such
as cellular phones, digital cameras, and tablet PC’s.
Ultra Small µClamp
®
1-Line, 3.3V ESD Protection
Features
High ESD withstand Voltage: +/-15kV (Contact) and
+/- 17kV (Air) per IEC 61000-4-2
Ultra-small package
Protects one data line
Low ESD clamping voltage
Working voltage: 3.3V
Low capacitance: 5pF maximum
Low leakage current
Extremely low dynamic resistance: 0.33 Ohms (Typ)
Solid-state silicon-avalanche technology
µClamp3321ZA
Mechanical Characteristics
SLP0603P2X3F package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiAu
Marking: Marking code
Packaging: Tape and Reel
Applications
Cellular Handsets & Accessories
Notebook Computers
Tablet PC
Portable Instrumentation
Peripherals
Package Dimensions
0.600
Schematic & Pin Configuration
0.220
0.300
1
2
SLP0603P2X3F (Bottom View)
1
www.semtech.com
0.160
0.355 BSC
0.250
Nominal Dimensions in mm
01/08/2015
µClamp3321ZA
PROTECTION PRODUCTS
Absolute Maximum Ratings
Rating
Peak Pulse Power (tp = 8/20µs)
Peak Pulse Current (tp = 8/20µs)
ESD per IEC 61000-4-2 (Air)
(1)
ESD per IEC 61000-4-2 (Contact)
(1)
Operating Temperature
Storage Temperature
Symbol
P
PK
I
PP
V
ESD
T
J
T
STG
Value
40
4
±17
±15
-40 to +125
-55 to +150
Units
W
A
kV
O
O
C
C
Electrical Characteristics (T=25
O
C unless otherwise specified)
Parameter
Reverse Stand-Off Voltage
Punch-Through Voltage
Reverse Leakage Current
Clamping Voltage
ESD Clamping Voltage
2
ESD Clamping Voltage
2
Dynamic Resistance
2, 3
Junction Capacitance
Symbol
V
RWM
V
PT
I
R
V
C
V
C
V
C
R
DYN
C
J
Conditions
Pin 1 to 2 or Pin 2 to 1
I
PT
= 50µA
Pin 1 to 2 or Pin 2 to 1
V
RWM
= 3.3V
Pin 1 to 2 or Pin 2 to 1
I
PP
= 4A, tp = 8/20µs
I
PP
= 4A
tp = 0.2/100ns
I
PP
= 16A
tp = 0.2/100ns
tp = 100ns
I/O pin to GND
f = 1MHz
V
R
= 0V
6.5
10.5
0.33
4.2
5
3.7
4.0
1
Min.
Typ.
Max.
3.3
4.7
50
8.5
Units
V
V
nA
V
V
V
Ohms
pF
Notes
1)Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, I
TLP
and V
TLP
averaging window: t1 = 70ns to t2 = 90ns.
3) Dynamic resistance calculated from I
TLP
= 4A to I
TLP
= 16A
2015 Semtech Corporation.
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µClamp3321ZA
PROTECTION PRODUCTS
Typical Characteristics
ESD Clamping (8kV Contact per IEC 61000-4-2)
45
40
35
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
ESD Clamping (-8kV Contact per IEC 61000-4-2)
5
0
-5
Clamping Voltage - V
C
(V)
30
25
20
15
10
5
0
-5
-10
0
10
20
30
40
50
60
70
80
Clamping Voltage - V
C
(V)
-10
-15
-20
-25
-30
-35
-40
-45
-10
0
10
20
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
Time (ns)
30
40
Time (ns)
50
60
70
80
TLP Characteristic (Positive Pulse)
30
25
20
Transmission Line Pulse Test
(TLP) Settings:
t
p
= 100ns, t
r
= 0.2ns,
I
TLP
and V
TLP
averaging window:
t
1
= 70ns to t
2
= 90ns
TLP Characteristic (Negative Pulse)
5
0
-5
TLP Current (A)
15
10
5
0
-5
TLP Current (A)
-10
-15
-20
-25
-30
Transmission Line Pulse Test
(TLP) Settings:
t
p
= 100ns, t
r
= 0.2ns,
I
TLP
and V
TLP
averaging window:
t
1
= 70ns to t
2
= 90ns
0
5
10
Clamping Voltage (V)
15
20
-15
-10
-5
Clamping Voltage (V)
0
Clamping Voltage vs. Peak Pulse Current (tp=8/20us)
10
9
6
5
Junction Capacitance vs. Reverse Voltage
Peak Clamping Voltage - V
C
(V)
8
7
6
5
4
3
2
1
0
0
1
T
A
= 25
O
C
Waveform: tp= 8x20us
Junction Capacitance - C
J
(pF)
4
3
2
1
0
f = 1MHz
T=25
o
C
2
3
Peak Pulse Current - I
PP
(A)
4
5
0
1
2
Voltage (V)
3
4
2015 Semtech Corporation.
3
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µClamp3321ZA
PROTECTION PRODUCTS
Applications Information
Assembly Guidelines
The small size of this device means that some care must
be taken during the mounting process to insure reliable
solder joint. The table below provides Semtech’s recom-
mended assembly guidelines for mounting this device.
The figure at the right details Semtech’s recommended
aperture based on the below recommendations. Note
that these are only recommendations and should serve
only as a starting point for design since there are many
factors that affect the assembly process. The exact
manufacturing parameters will require some experimen-
tation to get the desired solder application.
Assembly Parameter
Solder Stencil Design
Aperture shape
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
Recommendation
Laser cut, Electro-polished
Rectangular with rounded
corners
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
Non-Solder mask defined
OSP OR NiAu
Stencil Aperture
Mounting Pad
Package
0.175
0.272
0.250
0.298
0.270
Recommended Mounting Pattern
2015 Semtech Corporation.
4
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µClamp3321ZA
PROTECTION PRODUCTS
Outline Drawing - SLP0603P2X3F
A
D
B
DIMENSIONS
MILLIMETERS
DIM
MIN NOM MAX
A
A1
b
D
E
e
L
N
aaa
bbb
0.235 0.250 0.265
0.000 0.010 0.050
0.200 0.220 0.240
0.580 0.600 0.620
0.280 0.300 0.320
0.355 BSC
0.140 0.160 0.180
2
0.08
0.10
E
TOP VIEW
A
aaa C
SEATING
PLANE
C
A1
e/2
R0.025
TYP
bbb
bxN
C A B
2X L
e
BOTTOM VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP0603P2X3F
DIMENSIONS
DIM
G
X
Y
Z
MILLIMETERS
0.177
0.272
0.247
0.671
G
Z
Y
X
NOTES:
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2015 Semtech Corporation.
5
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