Ultra Small μClamp®
1 Line, 12V ESD Protection
PROTECTION PRODUCTS
Description
μClamp® TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to ESD. They
features large cross-sectional area junctions for
conducting high transient currents. These devices offer
desirable characteristics for board level protection
including fast response time, low operating and
clamping voltage,and no device degradation.
The μClamp®1211Z is in a 2-pin SLP0603P2X3 package.
It measures 0.6 x 0.3 mm with a nominal height
of only 0.25mm. The leads are finished with lead-free
NiAu. Each device will protect one line operating at
12 volts. It gives the designer the flexibility to protect
single lines in applications where arrays are not practical.
The combination of small size and high ESD surge
capability makes them ideal for use in portable
applications such as cellular phones, digital cameras, and
tablet PC’s.
μClamp1211Z
Features
• High ESD withstand Voltage: +/-30kV (Contact/Air) per
IEC 61000-4-2
• Able to withstand over 1000 ESD strikes per IEC61000-
4-2 Level 4
• Ultra-small 0201 package
• Protects one data line or power line
• Low leakage current: <50nA (V
R
=12V)
• Working voltage: +/-12V
• Low dynamic resistance: 0.30 Ω (typ)
• Solid-state silicon-avalanche technology
Mechanical Characteristics
•
•
•
•
•
•
SLP0603P2X3 package
Pb-Free, Halogen Free, RoHS/WEEE compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiAu
Marking: Marking code + dot matrix date code
Packaging: Tape and Reel
Applications
•
•
•
•
Cellular Handsets & Accessories
Portable Instrumentation
12V Power Protection
Tablet PC
Package Dimension
0.620
Schematic & Pin Configuration
0.220
0.320
1
2
SLP0603P2X3 (Bottom View)
0.160
0.355 BSC
0.250
Nominal Dimensions (mm)
μClamp1211Z
Final Datasheet
Revision date
Rev 5.1
2/22/2017
www.semtech.com
1 of 7
Semtech
Absolute Maximum Rating
Rating
Peak Pulse Power (tp = 8/20µs)
Peak Pulse Current (tp = 8/20µs)
ESD per IEC 61000-4-2 (Air)
(1)
ESD per IEC 61000-4-2 (Contact)
(1)
Operating Temperature
Storage Temperature
Symbol
P
PK
I
PP
V
ESD
T
J
T
STG
Value
175
7
±30
±30
-55 to +125
-55 to +150
Units
W
A
kV
O
O
C
C
Electrical Characteristics (T=25
O
C unless otherwise specified)
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Clamping Voltage
ESD Clamping Voltage
Dynamic Resistance
2,3
Junction Capacitance
Notes
1) ESD gun return path connected to ESD ground plane.
2) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, I
TLP
and V
TLP
averaging window: t1 = 70ns to t2 = 90ns.
3) Dynamic resistance calculated from I
TLP
= 4A to I
TLP
= 16A
2
Symbol
V
RWM
V
BR
I
R
V
C
V
C
V
C
R
DYN
C
J
Conditions
Pin1 to 2 or 2 to 1
I
t
= 1mA, Pin 1 to 2 or 2 to 1
V
RWM
= 12V, Pin 1 to 2 or 2 to 1
I
PP
=1A, tp = 8/20μs,
Pin1 to 2 or 2 to 1
I
pp
=7A, tp=8/20μs
Pin1 to 2 or 2 to 1
t
p
= 0.2/100ns
t
p
= 0.2/100ns
V
R
= 0V, f = 1MHz
T = 25
O
C
I
PP
= 4A
I
PP
= 16A
Min. Typ. Max. Units
12
14.2
15.8
<5
18
50
20
25
17.2
21
0.30
19
25
V
V
nA
V
V
V
Ω
pF
μClamp1211Z
Final Datasheet
Revision Date
Rev 5.1
2/22/2017
www.semtech.com
2 of 7
Semtech
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
10
T
A
=
25
O
C
Clamping Voltage vs. Peak Pulse Current (tp=8/20 μs)
25
Peak Pulse Power - P
PP
(kW)
20
1
Clamping Voltage - V
R
(V)
15
0.1
10
5
DR040412-125
Waveform:
Parameters:
5959.1
tr = 8µs
td = 20µs
0.01
0.1
1
10
Pulse Duration - tp (µs)
100
1000
0
0
1
2
3
4
5
Peak Pulse Current - I
PP
(A)
6
7
8
Capacitance vs. Reverse Voltage
25
30
25
TLP Current (A)
20
15
10
5
f = 1 MHz
TLP Characteristic (Positive Pulse)
20
Capacitance - C
j
(pF)
15
10
5
0
0
2
4
6
8
10
12
14
0
0
5
10
15
TLP Voltage (V)
20
25
30
Reverse Voltage - V
R
(V)
ESD Clamping (8kV Contact per IEC 61000-4-2)
45
40
Clamping Voltage (V)
Clamping Voltage (V)
35
30
25
20
15
10
5
0
-10
0
10
20
30
40
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected for
50 Ohm, 20dB attenuator. ESD gun return
path connected to ESD ground plane
ESD Clamping (-8kV Contact per IEC 61000-4-2)
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
80
-10
0
10
20
30
40
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected for
50 Ohm, 20dB attenuator. ESD gun return
path connected to ESD ground plane
50
60
70
50
60
70
80
Time (ns)
Time (ns)
μClamp1211Z
Final Datasheet
Revision Date
Rev 5.1
2/22/2017
www.semtech.com
3 of 7
Semtech
Application Information
Assembly Guidelines
The small size of this device means that some care must
be taken during the mounting process to insure reliable
solder joints. The figure at the right details Semtech’s
recommended mounting pattern. Recommended
assembly guidelines are shown in Table 1. Note that
these are only recommendations and should serve only
as a starting point for design since there are many factors
that affect the assembly process. Exact manufacturing
parameters will require some experimentation to get the
desired solder application.
Solder Stencil
Stencil design is one of the key factors which will
determine the volume of solder paste which is deposited
onto the land pad. The area ratio of the stencil aperture
will determine how well the stencil will print. The area
ratio takes into account the aperture shape, aperture
size, and stencil thickness. A minimum area ratio of 0.66
is preferred for the subject package. The area ratio of a
rectangular aperture is given as:
Area Ratio = (L * W )/ (2 * (L + W) * T)
Where:
L = Aperture Length
W = Aperture Width
T = Stencil Thickness
Semtech recommends a stencil with square aperture
and rounded corners for consistent solder release. The
stencil should be laser cut with electropolished finish. A
stencil thickness of 0.075mm (0.003”) is recommended.
A 0.100mm (0.004”) stencil may be used, however the
stencil opening may need to be increased slightly to
achieve the desired area ratio to ensure proper solder
coverage on the pad.
Recommended Mounting Pattern
Component
0.270
Land Pattern
0.620
0.175
0.675
0.250
0.320
Stencil Opening
All Dimensions are in mm.
Land Pad.
Stencil opening
Component
Table 1 - Assembly Guidelines
Assembly Parameter
Solder Stencil Design
Aperture Shape
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
Recommendation
Laser Cut, Electro-Polished
Rectangular with
Rounded Corners
0.075mm (0.003”) or
0.100mm (0.004”)
Type 4 Size Sphere or
Smaller
Per JEDEC J-STD-020
Solder Mask Defined
OSP or NiAu
μClamp1211Z
Final Datasheet
Revision Date
Rev 5.1
2/22/2017
www.semtech.com
4 of 7
Semtech
Outline Drawing - SLP0603P2X3
A
D
B
DIMENSIONS
DIM MILLIMETERS
MIN NOM MAX
A
A1
b
D
E
e
L
N
aaa
bbb
0.235 0.250 0.265
0.000 0.02 0.025
0.20 0.22 0.24
0.585 0.62 0.655
0.285 0.32 0.355
0.355 BSC
0.140 0.160 0.180
2
0.08
0.10
E
TOP VIEW
A
aaa C
SEATING
PLANE
C
A1
e/2
R0.025
TYP
bbb
bxN
C A B
2X L
e
BOTTOM VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP0603P2X3
DIMENSIONS
DIM
C
G
X
Y
Z
MILLIMETERS
(0.425)
0.175
0.270
0.250
0.675
(C)
G
Z
Y
X
NOTES:
1.
2.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
μClamp1211Z
Final Datasheet
Revision Date
Rev 5.1
2/22/2017
www.semtech.com
5 of 7
Semtech
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