Surface mount PTC devices are the preferred over-current protection method for computer, consumer electronic, por-
table electronics and automotive applications. These devices are suitable for automated assembly and are designed
to save on board space.
Ptc device
FeatuReS
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Resettable Over-Current Protection
Very Low Resistance
High Current Rating
Small Footprint of 1206
Fast Time-to-Trip
Lead-Free Solder Termination
RoHS & REACH Compliant
aPPLicatiOnS
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Mobile Phone Battery Packs
Cordless Phone Battery Packs
Mobile Radio Packs
Computer Battery Packs
Camcorder Battery Packs
SMART Phone Battery Packs
Computer Motherboards
mechanicaL chaRacteRiSticS
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Surface Mount Device: Size 1210
Approximate Weight: 0.0164 grams
Lead-Free
8mm Tape and Reel Per EIA Standard 481
enviROnmentaL SPeciFicatiOnS
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Recommended Storage Conditions: 40°C to 85°C
Passive Aging: 85°C, 1000 Hours
Moisture Resistance: 85% RH, 85°C, 1000 Hours
Thermal Shock: -40°C to 85°C, 30 Minute Cycle, 20 Cycles
Solder Leach Resistance and Terminal Adhesion: Per EIA-576 Test
05433.R0 7/13
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05433
Only One Name Means ProTek’Tion™
PLRO1206 Series
tyPicaL device chaRacteRiSticS
eLectRicaL SPeciFicatiOnS @ 25°c
PaRt
numBeR
maRkinG
cOde
hOLdinG
cuRRent
tRiP
OPeRatinG inteRRuPt maXium
cuRRent vOLtaGe cuRRent time-tO-tRiP
@5 i
h
a
t
tRiP
Seconds
4.0
4.0
i
h
amPS
PLRO1206-300
PLRO1206-380
nOteS
?
L
3.0
3.0
i
t
amPS
6.0
8.0
v
dc
vOLtS
6
6
i
maX
amPS
50
50
maXimum
tRiPPed
State POWeR
diSSiPatiOn
@6v
P
d
WattS
1.0
1.0
ReFeRence
maXimum
ReSiStance tWO hOuRS
(note 1)
POSt ReFLOW
R
ReSiStance
OhmS
R
min
tyP
OhmS
0.003
0.002
0.008
0.006
0.020
0.018
1. The maximum resistance of two hours post reflow is a reference value. The value may change a little according to reflow conditions and soldering state.
theRmaL deRatinG chaRt - ih(a)
PaRt numBeR
PLRO1206-300
PLRO1206-380
-40°c
4.8
5.4
-20°c
4.2
4.8
0°c
3.6
4.0
25°c
3.0
3.8
40°c
2.5
3.0
50°c
2.2
2.5
60°c
2.0
2.2
70°c
1.6
1.7
05433.R0 7/13
Page 2
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05433
Only One Name Means ProTek’Tion™
PLRO1206 Series
PackaGe OutLine and Pad LayOut inFORmatiOn
OutLine dimenSiOnS
dim
A
B
C
D
E
nOteS
0.25
0.05
D
E
C
miLLimeteRS
min
3.00
1.50
1.00
0.75
0.45
0.01
incheS
min
0.12
0.06
0.04
0.03
0.018
A
maX
3.40
1.80
maX
0.14
0.07
B
0.002
1. Dimensions are exclusive of mold flash and metal burrs.
OutLine dimenSiOnS
dim
F
G
H
nOteS
G
G
miLLimeteRS
nOm
1.80
1.00
1.80
incheS
nOm
0.07
0.04
0.07
H
F
1. Dimensions are exclusive of mold flash and metal burrs.
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice.
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering
and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of
its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special,
consequential or incidental damages.
LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory.
当今的计算机外部设备,都在追求高速度和高通用性。为了满足用户的需求,以Intel为首的七家公司于1994年推出了USB(Universal Serial Bus,通用串行总线)总线协议,专用于低、中速的计算机外设。目前,USB端口已成为微机主板的标准端口;而在不久的将来,所有的微机外设,包括键盘、鼠标、显示器、打印机、数字相机、扫描仪和游戏柄等等,都将通过USB与主机相连。
...[详细]